BondFilm? HP
High performance adhesion promotor for inner layer bonding
Super clean
By preventing more than 95% of sludge, by lower COD and waste-waster
Reliable
Great adhesion performance, thermal reliability and process control
Secure
Prevents high-resistance shorts and dendritic growth
BondFilm? HP
Our high performance BondFilm HP? is the latest generation of our trusted BondFilm? series. It has been developed with the most demanding applications in mind, where residues, dirt and other contaminants must be excluded.
Our BondFilm HP? is used where products must be long lasting and reliable. Whether in the telecommunications sector or for automotive applications, the latest BondFilm? in the series is extremely versatile.
- Ultra low sludge formation
- Prevents high-resistance shorts and dendritic growth
- High copper loading
- Less waste-waster
- Less maintenance needed
- Lower etch-depth
- Great adhesion performance
- Greenest of BondFilm? yet
What inspires us
Why we developed BondFilm? HP
Your challenge
In order to satisfy the high quality standards of leading automotive and computing OEMs, only the best tools are sufficient. With BondFilm HP? you are well equipped to master the fierce competition.
Our solution
BondFilm? HP is a clean pretreatment for inner layer bonding that makes producing flawless circuits a breeze.