Everplate? 2XT
Cost-effective copper damascene process
Damascene copper fill
For 28 nm nodes and above
Cost effective
High-yield and efficient fill
Excellent process control
Online analysis available (ECI, RTA)
Everplate? 2XT is a ECD Cu Damascene filling process and consists of a wide range of additives containing multiple accelerator, suppressor and leveler types that can be individually selected and combined for an optimum custom process performance. The process is compatible with a wide range of base electrolytes and designed to generate high yield fill for older generation technology nodes.
- Interconnect metallization
- Nodes >28 nm
- Excellent performance with a cost-effective solution
- Custom tailored chemistry suite for optimum performance on every application
- Copper film properties can be adjusted over a wide range to meet reliability targets
- Solutions available for a wide range of base electrolytes on all ECD Cu plating tools
- MKS¡¯ Atotech offers process development and implementation expertise
What inspires us
Why we developed Everplate? 2XT
Your challenge
The damascene copper interconnect metallization process has been used successfully for many years now. It has proven to be a successful technology that enabled a true revolution in the chip interconnect metallization. Many applications across the field have reaped the benefits of this integration scheme varying from the most cutting-edge logic and memory to high power capable IGBTs. For some applications, interconnect dimensions have not been under the extreme pressure to reduce in size along with the most cutting-edge low power applications.
Our solution
The Everplate? 2XT additive suite is a customizable chemistry set, developed to offer solid performance for technology nodes at 28 nm and above. It provides a cost-effective solution that can be highly tailored to maximize yield and performance across a wide range of applications. We offer expertise in the selection, optimization, and implementation of a custom Everplate? process to meet and exceed performance targets while keeping an eye on robustness and return of investment.
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