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Berlin, 20 March, 2018: Neoganth? W Pre Dip is Atotech¡¯s new process for the desmear and metallization (PTH) process step for fine line HDI and package substrate applications. The new pre dip assures higher yield rates due to a significantly reduced occurrence of short circuits.

The trend for ever smaller lines and spaces in advanced HDI boards for mobile applications continues. Lines and spaces (L/S) will be reduced to 25/25 ?m by 2019. The trend was made possible by manufacturing technologies such as modified semi-additive processes (mSAP) and advanced modified semi-additive processes (amSAP). With this minimization comes the need for new PORs (process of record), which offer significant technical advantages over existing ones.

Neoganth? W Pre Dip

Atotech¡¯s newly developed Neoganth? W Pre Dip is a low foaming activator pre dip designed for horizontal transportation mode such as in Atotech¡¯s Uniplate? LB line. The process leads to a significant reduction in particle formation thereby enabling higher yield rates in fine line production. A key feature to achieve this is its alkaline pH.

Customer data has shown that using Neoganth? W Pre Dip reduces the occurrence of short circuits in the process by up to 50% compared to competitive products. At the same time, the process provides excellent coverage performance while significantly reducing foaming behavior.

Neoganth? W Pre Dip is best used in front of an ionic PTH activator, such as Neoganth? U Activator or Neoganth? X Activator. It ensures proper wetting, pre-conditions the glass fibers and securely removes remaining copper oxides after etch cleaning.

The process has already been rolled-out successfully in Korea, Taiwan and China. Its key benefits allow it to exceed previous PTH POR process steps thereby assuring customers receive outstanding performance results.