[et_pb_section fb_built=”1″ admin_label=”section” _builder_version=”4.17.6″ da_disable_devices=”off|off|off” global_colors_info=”{}” da_is_popup=”off” da_exit_intent=”off” da_has_close=”on” da_alt_close=”off” da_dark_close=”off” da_not_modal=”on” da_is_singular=”off” da_with_loader=”off” da_has_shadow=”on”][et_pb_row column_structure=”1_3,2_3″ admin_label=”row” _builder_version=”4.17.6″ background_size=”initial” background_position=”top_left” background_repeat=”repeat” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2022\/10\/Logo.jpg” title_text=”Logo” _builder_version=”4.22.1″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”2_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_text _builder_version=”4.22.1″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n
Berlin, October 19, 2023 <\/strong>jmÌìÌùÙÍøInstruments, Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (Laser Systems) and Atotech (process chemicals, equipment, software, and services) will present their combined product offering of leading manufacturing solutions for printed circuit boards and package substrate manufacturing at the upcoming 24th<\/sup> Taiwan Circuit Board Industry International Exhibition (TPCA Show 2023), and the 18th International Microsystems, Packaging, Assembly and Circuit Technology Conference (IMPACT 2023), to be held from October 25th<\/sup> to 27th<\/sup>, 2023 at Taipei Nangang Exhibition Center.<\/p>\n By combining leading capabilities in lasers, optics, motion, process chemistry, and equipment, jmÌìÌùÙÍøis best positioned to Optimize the InterconnectSM<\/sup><\/strong>, a significant enabling point for next-generation advanced electronics that represent the next frontier for miniaturization and complexity. The Optimize the InterconnectSM<\/sup> philosophy highlights the company\u2019s unique position in supporting the development of next-generation advanced PCB and package substrate manufacturing solutions for its customers and partners. \u201cWe are committed to enabling new technologies and increasingly smaller feature sizes by combining MKS\u2019 ESI laser drilling technologies with MKS\u2019 Atotech chemistry and plating equipment,\u201d stated Harald Ahnert, VP and GM of Chemistry.\u201d<\/p>\n The company\u2019s combined expertise and know-how across lasers, materials processing, and equipment technology provides numerous opportunities to facilitate collaboration, innovation, and continual ground-breaking solutions for its customers. \u201cWe recently installed new systems and process technology in one of our global technology centers to drive the production of next-generation package substrates and provide customers and OEMs alike quicker development cycles for new products and materials enabling high-end SAP technology<\/strong> that require <5\/5 \u00b5m lines and spaces,\u201d added Harald.<\/p>\n Another example of MKS\u2019 contributions to innovation is the company\u2019s progress in flex, advanced HDI or substrate-like PCBs<\/strong>. Here our customer offering ranges from a comprehensive combination of optimized laser drilling and process chemistries to PCB manufacturing equipment. Customers benefit from the company\u2019s unique one-stop-shop destination for pre-treatment, via formation, plating, and final finishing with quick turn-around times that don\u2019t require an interruption in production, which enables our customers to deliver better yields, productivity, and performance. \u201cFor substrate-like PCBs, we are working with the industry to enable next generation mSAP technology,<\/strong>\u201d said Harald Ahnert, VP and GM of Chemistry.<\/p>\n Experts from both brands will be available and ready to discuss latest industry trends and challenges at TPCA Show booth N-718<\/strong> on the 4th<\/sup> floor of the Nangang Exhibition Hall 1. The dedicated onsite team will introduce new product combinations, including printed circuit board production equipment (wet-to-wet process equipment, laser systems and auxiliary equipment), chemistry, software, and related services. On the laser equipment side, promotions include the latest Capstone\u2122 (UV Laser for Flex PCBs) and Geode\u2122 (CO2 laser for HDI and package substrate applications) capabilities.<\/p>\n In addition to participating in the exhibition, the team is honored to once again be given the opportunity to host an IMPACT industrial forum. This year the focus is on \u201cAI-enabling innovation in the era of advanced packaging.\u201d The exclusively invited speakers, together with MKS\u2019 Atotech experts, will present four relevant topics\/papers on this theme on the 4th floor in room R504b, from 1:30 to 3:30pm on October 25. The team will also present seven additional papers during the general IMPACT technical conference from October 26 to 27, see tables below.<\/p>\n TPCA Show highlights 2023 briefly: <\/u><\/strong><\/p>\n EcoFlash\u00ae S300:<\/strong> Differential etching solution suitable for ultra-fine lines on IC substrates. IMPACT MKS\u2019 Atotech Industrial Forum speakers, location and time: [\/et_pb_text][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2023\/10\/1-1.png” title_text=”1″ _builder_version=”4.22.1″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][et_pb_text _builder_version=”4.22.1″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n IMPACT MKS\u2019 Atotech and ESI Technical Forum speakers, locations and times:<\/strong><\/p>\n [\/et_pb_text][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2023\/10\/Bild4.png” title_text=”Bild4″ _builder_version=”4.22.1″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":" Berlin, October 19, 2023 jmÌìÌùÙÍøInstruments, Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (Laser Systems) and Atotech (process chemicals, equipment, software, and services) will present their combined product offering of leading manufacturing solutions for printed circuit boards and package substrate manufacturing at […]<\/p>\n","protected":false},"author":43,"featured_media":97502,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":6,"footnotes":""},"categories":[656,657],"tags":[],"class_list":["post-97500","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-ko","category-tradeshows-events-ko"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/posts\/97500","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/users\/43"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/comments?post=97500"}],"version-history":[{"count":1,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/posts\/97500\/revisions"}],"predecessor-version":[{"id":97507,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/posts\/97500\/revisions\/97507"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/media\/97502"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/media?parent=97500"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/categories?post=97500"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/ko\/wp-json\/wp\/v2\/tags?post=97500"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
On the chemistry side, for surface treatment our highlights include EcoFlash\u00ae S300, a new differential etching solution suitable for advanced IC substrates and Novabond\u00ae EX-S2, our new high-tech adhesion promoter for ultra-fine lines and high-speed applications. For metallization our highlights include Printoganth\u00ae MV TP2, a highly capable electroless copper process specifically designed for SAP fine line applications, and our even more enhanced Printoganth\u00ae MV TP3 process enabling super thin Cu deposits for fine lines down to 2\/2 \u00b5m L\/S which you want to ideally combine with Cupraganth\u00ae MV our new and revolutionary copper-based activation system. For electrolytic copper plating, we are highlighting our new insoluble reverse pulse plating solution for inclusion-free IC substrate core through hole filling for high aspect ratio, Inpulse\u00ae 2THF2, and our production proven InPro\u00ae SAP3 process for BMV filling with best uniformity at high current densities. For conformal high hole density IC substrate core plating we are promoting Cuprapulse\u00ae IN, our new solution for excellent uniformity for high hole density boards.
For final finishing our highlights range from OSP solution OS-Tech\u00ae SIT 2, a new generation corrosion-free gold process for ENIG, ENEPIG, and EPAG to new type of immersion tin processes for flex PCBs, as well as for thick tin plating of \u00b5-LED, IC substrates, or solder depot plating.<\/p>\n
Novabond\u00ae EX-S2:<\/strong> Adhesion promoter suitable for ultra-fine lines and high-speed applications.
Capstone<\/strong>TM<\/strong><\/sup>: <\/strong>High-performance\/throughput breakthrough productivity for flex PCB UV drilling.
Geode<\/strong>TM<\/strong><\/sup>\u00a0A:<\/strong> CO2 laser system for high precision and high-speed ABF build-up laminate processing.
Cuprapulse\u00ae IN:<\/strong> Insoluble reverse pulse plating for high throughput HDI and MLB PCBs.
Cupraganth\u00ae MV:<\/strong> New Cu based activator system enabling high yield IC substrates.
Printoganth\u00ae MV TP2:<\/strong> State of the art electroless copper process for fine line SAP applications.
Printoganth\u00ae MV TP3:<\/strong> Upcoming electroless copper process for super fine lines L\/S like 2\/2 \u00b5m.
Printoganth\u00ae\u00a0P2:<\/strong> Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.).
G-Plate\u00ae: <\/strong>New equipment technology for PTH processes of next generation IC substrates enabling highest yields and cutting-edge fine line capability targeting L\/S <5\/5 \u00b5m.
Aurotech\u00ae G-Bond 3:<\/strong> New versatile gold bath for nickel\/gold, nickel\/palladium\/gold and palladium\/gold plating with non-toxic stabilizer replenishment to prevent the handling of KCN with low gold content and long lifetime.
Stannatech\u00ae Flex:<\/strong> tailored immersion tin process for battery flexible board with mitigated substrate and coverlay attack.
PD-Core\u00ae:<\/strong> Versatile Palladium plating solution for plating on copper and nickel with low Pd-content and long lifetime for reduced process cost.
Stanna-CAT\u00ae:<\/strong> Autocatalytic process for thick tin plating of \u00b5-LED, ICS, or solder depot plating.
Silvertech\u00ae C:<\/strong> New silver-plating process that co-deposits 1-2% w\/w carbon and produces a highly electrically conductive surface.
Protectostan\u00ae LF-E:<\/strong> New sustainable post-treatment to protect the plated tin and tin alloy surfaces of connectors and integrated circuits (ICs) from discoloration under high temperature \/ reflow and tarnishing under high heat high humidity conditions.
vPlate\u00ae: <\/strong>Vertical continuous plating equipment for advanced HDI and IC substrate achieving uniformities of below 7%.<\/p>\n
1:30 PM \u2013 3:30 PM | Theme: AI Creating a New ERA of Advanced packaging <\/strong><\/p>\n