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- Highly suitable for application in the automotive, sanitary, cosmetics, furniture and electronic goods industries
- Wide variety of applications such as plating on plastics (ABS and ABS/PC) or metal-based applications
CuFlex? family
Advanced decorative copper plating solutions
MKS’ Atotech CuFlex? process range is the perfect choice when it comes to dye-free processes. Avoiding sludge formation and preventing tanks and anode bags from changing color, dye-free electrolytes also eliminate issues related to over-leveling, pit and pores and provide higher resistance to burning.
Even though acid coppers are mostly used as intermediate layers, their importance is critical to the overall performance of plated parts. MKS’ Atotech CuFlex? offers excellent ductility and good throwing power with a high brightness level. This makes it an advanced decorative copper plating solution for a multitude of applications.
CuFlex? 730 is a high efficiency copper bath designed for the deposition of low-stressed, ductile and bright copper layers. It minimizes the build-up of copper at the edges and is highly resistant to burning. CuFlex? 730 is recommended for substrates where the leveling requirements are low (eg. plastics).
CuFlex? 740 is a dye-free copper electrolyte designed to reduce hydrodynamic effects and over-leveling (orange peel). It is recommended for low to medium leveling requirements.
Atotech offers a broad range of CuFlex? additives such as brightener, make up, leveler, promoter and booster.
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