Spherolyte?
Electrochemical plating solutions for pillar and RDL packaging applications
Highest speed plating
Pure and uniform metal deposition
Pillar and RDL plating
The Spherolyte? portfolio consists of pre-treatment solutions, various base electrolytes, and both two and three component additive systems. Spherolyte? chemistries are tailored for high end electrochemical processes for Cu, Ni, Sn, and Au in advanced packaging applications such as pillar and RDL structures.
Spherolyte? Cu is designed to enable pure and uniform Cu deposits at high speed, and with lower costs.
Following the Cu deposition for pillar formation, Spherolyte? Ni and Spherolyte? Sn are used as diffusion barrier and solder joint connection, respectively.
- Flip chip
- FOWLP
- MEMS
- Sensors
Our proven Spherolyte? portfolio satisfies the following process and deposition requirements at high speed:
Cu
- Sulfuric acid based Cu electrolyte system
- Pure Cu deposition and excellent WIW nonuniformity
- High speed plating
- Low warpage and internal stress
- Low organic impurities
Ni
- Sulfamate based solution
- Full liquid process
- Uniform Ni distribution as diffusion barrier
- Low porosity, high ductility
- Enhanced deposition rate
Sn
- Fine grain structures
- Good solderability
- High plating stability
- Inhibited whisker formation
Au
- Excellent bondability and solderability
- Excellent physical properties of the deposit
- Fast deposition rate
- Wide and robust process window
Aurolyte? Au may additionally be used for soldering and Au pillar plating in MEMS and sensor applications.
Why we developed Spherolyte?
Your challenge
Driven by cost reduction and increased performance, the main challenges for Cu pillar plating are: high throughput, no voiding in IMC, and excellent uniformity.
Our solution
Spherolyte? Cu is a high speed plating process that enables pure Cu deposition for void free plating and low non-uniformity.
Image gallery
Pillar plating
Copper fine line
Spherolyte? for pillar plating
Spherolyte? for RDL plating
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