Berlin, September 17 — jmÌìÌùÙÍøInc. (NASDAQ: MKSI), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech? (process chemicals, equipment, software, and services) and ESI? (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming electronica India to be held at Bangalore International Exhibition Centre, Bengaluru from September 17-19, 2025.
Leveraging its expertise across lasers, optics, motion, process chemistry, and equipment, jmÌìÌùÙÍøis pioneering next-generation interconnect solutions to meet the demands of miniaturization and complexity in advanced electronics. The company¡¯s?Optimize the InterconnectSM philosophy reflects its unmatched ability to enable innovation, empowering customers and partners with integrated, cutting-edge solutions for advanced PCB and package substrate manufacturing. By combining MKS¡¯s ESI industry-leading laser drilling technologies with MKS¡¯s Atotech chemistry and plating systems, the company is setting new benchmarks for precision, performance, and scalability – key to enabling next-generation technologies with finer features.
At booth H3-H01, jmÌìÌùÙÍøwill showcase the latest innovations in lasers, optics, motion control, process chemistry, and advanced equipment – key innovations shaping the future of PCB manufacturing.
This year the spotlight is on the following featured Atotech products:
Noviganth? AF: High-build self-accelerating electroless copper
Cupracid? AC6: Conformal DC plating for high volume production
StannoPure? PF10: High speed green tin process for lead frames and connectors
Spherolyte? Cu UF 3: Copper RDL process for fine line plating and microvia filling
ESI product highlights include:
GeodeTM G2 PCB laser drill: Maximize throughput and yield in HDI and ICP manufacturing with unmatched drilling speed and precision. Geode? G2 combines a high-power CO? laser with HyperSonix? energy control for next-gen microvia performance.
CapStone? Flex PCB laser drill: Achieve up to 2¡Á faster throughput and 30% lower processing costs in flex PCB manufacturing. CapStone? uses a high-repetition UV laser and optimized energy profile for reliable results across current and next-gen materials.
Event: Electronica India 2025
Date: September 17-19, 2025
Booth:H3-H01
Venue: Bangalore International Exhibition Centre, Bengaluru
For more information on Electronica India 2025 please visit: