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Berlin, June 12, 2023<\/strong> \u2013 MKS\u2019 Atotech will be participating at the upcoming Semicon China a leading exhibition for China’s semiconductor industry. The event will take place from June 29 – July 1, at the Shanghai New International Expo Centre. MKS\u2019 Atotech product experts will be available at booth E5243 and the team is looking forward to introducing the latest solutions for wet metallization for power semiconductors, advanced packaging, and lead frames.<\/p>\n Modern semiconductor devices require different plating solutions for various applications and structures. MKS\u2019 Atotech provides leading ENEPIG and ENEPAG plating solutions for pad metallization for bonding, soldering applications, and RDL housing in power semiconductors, as well as electrolytic processes for pillars, micro vias, fine line RDL, and solder applications. A broad portfolio of Sn processes, adhesion promoters, and post-treatments for lead frames completes the portfolio.<\/p>\n This year\u2019s show highlights include:<\/p>\n Xenolyte\u00ae Au TG<\/strong> \u2013 A new autocatalytic, thick Au process for final finish on Ni or Pd for pad metallization<\/p>\n Xenolyte\u00ae Ni TR<\/strong> \u2013 A new high temperature resistant Ni for RDL and pad metallization<\/p>\n Xenolyte\u00ae Pd HS<\/strong> \u2013 A new pure Pd deposits for high reliability pad metallization and RDL housing<\/p>\n StannoPure\u00ae 3000 E<\/strong> \u2013 A new sustainable high-speed matte tin process<\/p>\n PPFPrep<\/strong> \u2013 A new NEAP solution that assures excellent adhesion and significant cost savings<\/p>\n Event: Semicon China 2023
\nDate: June 29 \u2013 July 1, 2023
\nVenue: Shanghai New International Expo Centre
\nBooth: E5243<\/p>\n