[et_pb_section fb_built=“1″ disabled_on=“off|off|off“ admin_label=“section“ _builder_version=“4.16″ da_disable_devices=“off|off|off“ global_colors_info=“{}“ da_is_popup=“off“ da_exit_intent=“off“ da_has_close=“on“ da_alt_close=“off“ da_dark_close=“off“ da_not_modal=“on“ da_is_singular=“off“ da_with_loader=“off“ da_has_shadow=“on“][et_pb_row column_structure=“1_3,2_3″ _builder_version=“4.16″ background_size=“initial“ background_position=“top_left“ background_repeat=“repeat“ global_colors_info=“{}“][et_pb_column type=“1_3″ _builder_version=“4.16″ custom_padding=“|||“ global_colors_info=“{}“ custom_padding__hover=“|||“][et_pb_image src=“https:\/\/www.atotech.com\/wp-content\/uploads\/2020\/09\/SCTaiwan_RGB_ms-300×96.jpg“ title_text=“SCTaiwan_org“ align_tablet=“center“ align_phone=““ align_last_edited=“on|desktop“ admin_label=“Logo“ _builder_version=“4.16″ animation_style=“slide“ animation_direction=“left“ animation_duration=“500ms“ animation_intensity_slide=“10%“ z_index_tablet=“500″ global_colors_info=“{}“][\/et_pb_image][\/et_pb_column][et_pb_column type=“2_3″ _builder_version=“4.16″ custom_padding=“|||“ global_colors_info=“{}“ custom_padding__hover=“|||“][et_pb_text admin_label=“jmÌìÌùÙÍø to participate in SEMICON TW“ _builder_version=“4.16″ text_font_size=“18″ z_index_tablet=“500″ global_colors_info=“{}“]<\/p>\n
Berlin, September 10, 2020 –<\/strong> Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate and semiconductor manufacturing, is pleased to announce its participation in this year\u2019s SEMICON Taiwan, held at the Taipei Nangang Exhibition Center from September 23 \u2013 25. SEMICON Taiwan is a conference and exhibition fully dedicated to semiconductor technologies.<\/p>\n Atotech\u2019s experts will be presenting highlights from our competitive product range at booth K2276 on the 1st floor and discuss the latest technology, trends, and future requirements. Special features at the booth will include: <\/p>\n PromoBond\u00ae:<\/span><\/strong> an adhesion promoter, that is designed to form a strong composite between Cu RDL and dielectric to enable excellent mechanical properties, especially for shrinking dimensions.<\/p>\n Spherolyte\u00ae Cu UF3:<\/span><\/strong> a high purity ECD copper process that enables stable and optimal mechanical properties within a wide process window.<\/p>\n MultiPlate\u00ae:<\/span><\/strong> a new system platform for FOWLP \/ FOPLP.<\/p>\n Spherolyte\u00ae SnAg:<\/span><\/strong> Atotech\u2019s high speed SnAg for lead-free, pure, and uniform solder bump plating.<\/p>\n Xenolyte\u00ae Ni RE:<\/span><\/strong> an electroless nickel housing to protect fine line RDL structures.<\/p>\n NEAP X.1 \/ X.2:<\/span><\/strong> a next-generation non-etching adhesion promoter for leadframes.<\/p>\n We are also pleased to announce that on Tuesday, September 22, from 3:20 to 3:45 p.m., Atotech\u2019s R&D Manager Semiconductor Advanced Packaging, Dr. Ralf Schmidt, will talk about \u201cCustom-designed plating processes for next-generation copper pillar applications\u201d at the SiP Global Summit 2020 \u2013 Heterogeneous Integration NOW & FUTURE \u2013 Day 1. <\/p>\n Visitors to the show are invited to attend Ralf’s presentation and to stop by our booth K2276 to learn more about custom-designed plating processes and other innovative solutions Atotech offers to the semiconductor industry. <\/p>\n