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Spherolyte\u00ae UF3 \u2013 Electrolytic Cu process for RDL, fine-line RDL, RDL+ VIA, Pillar<\/p>\n
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Berlin, 10 May, 2019:<\/strong> At this year\u2019s IEEE 69th Electronics Components and Technology Conference (ECTC) Atotech will be presenting its product lineup, roadmap and a technical paper for semiconductor advanced packaging solutions. The ECTC, held at the Cosmopolitan of Las Vegas in Las Vegas, NV, USA from May 28 till May 31, is the industry\u2019s premier international conference, where the industry\u2019s leading experts come together to discuss and learn about packaging, components and science and design of microelectronic components.<\/p>\n Atotech will showcase its latest metallization products including the Spherolyte\u00ae product line for next generation RDL and pillar, the Xenolyte\u00ae product line for all electroless metallization needs, as well as its new MultiPlate\u00ae electrolytic deposition platform, designed as a flexible solution for both wafer and panel plating. In-depth information on Atotech\u2019s product lineup can be found at our booth 308, where Atotech experts can help select the processes and equipment for the next generations of advanced packaging techniques.<\/p>\n In session 3: RDL and Additive Manufacturing, on Wednesday, May 29, from 8:50 a.m. to 9:15 p.m.,
\nRalph Zoberbier, Director Sales & Marketing EQ EL, will present \u201cOptimization of Electrolytic Plating Processes for Challenging Fan-Out Panel-Level Package Designs\u201d (co-authors: Britta Scheller, Director R&D EQ GMF \/ EL, and Christian Ohde, Global Application Manager PP Vertical).<\/p>\n