  {"id":48299,"date":"2016-02-17T14:43:53","date_gmt":"2016-02-17T14:43:53","guid":{"rendered":"https:\/\/www.atotech.com\/?page_id=48299"},"modified":"2024-05-03T10:24:38","modified_gmt":"2024-05-03T08:24:38","slug":"halbleiter","status":"publish","type":"page","link":"https:\/\/www.atotech.com\/de\/produkte\/electronics\/halbleiter\/","title":{"rendered":"Semiconductor"},"content":{"rendered":"<p>[et_pb_section fb_built=&#8220;1&#8243; fullwidth=&#8220;on&#8220; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;Top&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_fullwidth_slider show_arrows=&#8220;off&#8220; show_pagination=&#8220;off&#8220; admin_label=&#8220;Hero Slider Small&#8220; module_id=&#8220;Top&#8220; module_class=&#8220;atotech-smallslider&#8220; _builder_version=&#8220;4.16.1&#8243; background_position=&#8220;top_left&#8220; custom_padding=&#8220;100px||100px|&#8220; custom_padding_tablet=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; button_text_size__hover_enabled=&#8220;off&#8220; button_text_size__hover=&#8220;null&#8220; button_one_text_size__hover_enabled=&#8220;off&#8220; button_one_text_size__hover=&#8220;null&#8220; button_two_text_size__hover_enabled=&#8220;off&#8220; button_two_text_size__hover=&#8220;null&#8220; button_text_color__hover_enabled=&#8220;off&#8220; button_text_color__hover=&#8220;null&#8220; button_one_text_color__hover_enabled=&#8220;off&#8220; button_one_text_color__hover=&#8220;null&#8220; button_two_text_color__hover_enabled=&#8220;off&#8220; button_two_text_color__hover=&#8220;null&#8220; button_border_width__hover_enabled=&#8220;off&#8220; button_border_width__hover=&#8220;null&#8220; button_one_border_width__hover_enabled=&#8220;off&#8220; button_one_border_width__hover=&#8220;null&#8220; button_two_border_width__hover_enabled=&#8220;off&#8220; button_two_border_width__hover=&#8220;null&#8220; button_border_color__hover_enabled=&#8220;off&#8220; button_border_color__hover=&#8220;null&#8220; button_one_border_color__hover_enabled=&#8220;off&#8220; button_one_border_color__hover=&#8220;null&#8220; button_two_border_color__hover_enabled=&#8220;off&#8220; button_two_border_color__hover=&#8220;null&#8220; button_border_radius__hover_enabled=&#8220;on&#8220; button_border_radius__hover=&#8220;3&#8243; button_one_border_radius__hover_enabled=&#8220;off&#8220; button_one_border_radius__hover=&#8220;null&#8220; button_two_border_radius__hover_enabled=&#8220;off&#8220; button_two_border_radius__hover=&#8220;null&#8220; button_letter_spacing__hover_enabled=&#8220;on&#8220; button_letter_spacing__hover=&#8220;0&#8243; button_one_letter_spacing__hover_enabled=&#8220;off&#8220; button_one_letter_spacing__hover=&#8220;null&#8220; button_two_letter_spacing__hover_enabled=&#8220;off&#8220; button_two_letter_spacing__hover=&#8220;null&#8220; button_bg_color__hover_enabled=&#8220;off&#8220; button_bg_color__hover=&#8220;null&#8220; button_one_bg_color__hover_enabled=&#8220;off&#8220; button_one_bg_color__hover=&#8220;null&#8220; button_two_bg_color__hover_enabled=&#8220;off&#8220; button_two_bg_color__hover=&#8220;null&#8220;][et_pb_slide use_bg_overlay=&#8220;off&#8220; use_text_overlay=&#8220;off&#8220; _builder_version=&#8220;4.16.1&#8243; background_color=&#8220;#ffffff&#8220; background_image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/06\/SC-2021-header.jpg&#8220; background_enable_image=&#8220;on&#8220; background_position=&#8220;top_center&#8220; button_on_hover=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; sticky_transition=&#8220;on&#8220;]<\/p>\n<div class=\"slidercontent-left\">\n<h3>Branchenf\u00fchrende Chemikalien f\u00fcr die Padmetallisierung,<\/h3>\n<h3>sowie Kupfer Pillar-, RDL-, TSV- und Dual-Damascene-Verfahren (Unser Produktportfolio)<\/h3>\n<p><a class=\"et_pb_more_button et_pb_button\" href=\"#ProductPortfolio\">Our product portfolio<\/a><\/p>\n<\/div>\n<p>[\/et_pb_slide][\/et_pb_fullwidth_slider][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;breadcrumb-container&#8220; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;0|||&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; 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module_alignment=&#8220;left&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<nav class=\"atotech-breadcrumb\"><a href=\"https:\/\/www.atotech.com\/de\/\">Home<\/a> <span class=\"bc-divider\"><i class=\"icon-arrow\"><\/i><\/span> <span class=\"current-page\">Seite<\/span><\/nav>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;atotech-detailheader&#8220; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;0|||&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; 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use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h1>Halbleiter<\/h1>\n<h2>Integrierte nasschemische Verfahrens- und Anlagenl\u00f6sungen f\u00fcr aktuelle und zuk\u00fcnftige Packaging- und Halbleiteranwendungen<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Quick facts&#8220; module_class=&#8220;same-height list-line-style&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h4>Quick facts<\/h4>\n<ul class=\"facts\">\n<li>Fortschrittliche L\u00f6sungen f\u00fcr Packaginganwendungen \u2013 chemische und elektrochemische Abscheidung von Cu, Ni, Pd, Sn, SnAg und Au<\/li>\n<li>Elektrochemische L\u00f6sungen f\u00fcr die neueste Verbindungstechnologie \u2013 Damascene-Verfahren mit Cu und Co<\/li>\n<li>MultiPlate: eine innovative elektrochemische Beschichtungsanlage<\/li>\n<li>Hightech-Reinraumproduktion<\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Applications&#8220; module_class=&#8220;same-height list-line-style&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h4>Anwendungen<\/h4>\n<ul>\n<li>Pad-Metallisierung mit ENEPIG f\u00fcr Leistungschips und Speicher<\/li>\n<li>RDL, Microvias und Pillar-Plating f\u00fcr FOWLP und FC-CSP<\/li>\n<li>Microvia-TSV-Plating \/ Filling f\u00fcr Sensoren und 3D-Stacking<\/li>\n<li>Doppelseitige Metallisierung f\u00fcr Leistungschips wie z.B. IGBT, MOSFETS, etc..<\/li>\n<li>Verbindungsmetallisierung f\u00fcr Logik-, Speicher- und Leistungs-IC<\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; fullwidth=&#8220;on&#8220; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_fullwidth_menu menu_id=&#8220;35&#8243; submenu_direction=&#8220;downwards&#8220; fullwidth_menu=&#8220;off&#8220; module_id=&#8220;atotech-sticky-nav&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#5992d6&#8243; text_orientation=&#8220;center&#8220; background_layout=&#8220;dark&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_fullwidth_menu][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;ProductPortfolio&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row padding_mobile=&#8220;off&#8220; column_padding_mobile=&#8220;on&#8220; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Product portfolio&#8220; _builder_version=&#8220;4.16.1&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;center&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Produkt\u00fcbersicht<\/h2>\n<p>[\/et_pb_text][et_pb_accordion _builder_version=&#8220;4.16.1&#8243; body_font_size=&#8220;17&#8243; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_accordion_item title=&#8220;RDL, Microvias und Pillar-Plating f\u00fcr FOWLP und FC-CSP&#8220; open=&#8220;on&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-23124 size-full\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-1-2.jpg\" alt=\"Atotech\" width=\"230\" height=\"378\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-1-2.jpg 230w, https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-1-2-183x300.jpg 183w\" sizes=\"(max-width: 230px) 100vw, 230px\" \/>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<p><strong>Ihre Anforderungen:<\/strong><\/p>\n<p>Die neuesten Packaging-Technologien wie FOWLP erfordern diverse Beschichtungsl\u00f6sungen f\u00fcr unterschiedliche Strukturen. Kupfer f\u00fcr Fine-Line-RDL mit und ohne gef\u00fcllte Microvias, Cu-Pillars mit und ohne Nickel-Sperrschichten und nicht zuletzt Zinn-Silber f\u00fcr L\u00f6tkappen auf Pillars. Um beste Zuverl\u00e4ssigkeiten zu erm\u00f6glichen, ist die Reinheit der Kupferschicht entscheidend. Die Reinheit bestimmt die Zuverl\u00e4ssigkeit des gesamten Packages und die Vermeidung vor RDL-Fehlstellen (Cracks) beim Fan-out Wafer Level Packaging oder Mikrovoids\/ Lunker an Kupfer\/Lot-Verbindungen<\/p>\n<p><strong>Unsere L\u00f6sung:<\/strong><\/p>\n<p>Atotech bietet das komplette Beschichtungssortiment f\u00fcr Pillars, Microvias und Fine-Line-RDL \u2013 Hochreine Cu-Schichten f\u00fcr h\u00f6chste Zuverl\u00e4ssigkeitsanforderungen, seien es RDL, Microvias oder Cu-Pillars. Ein Cu-Elektrolyt f\u00fcr Alles, Beschichtung aller Strukturen \/ Geometrien Microvias, Fine-Line-RDL und Pillars.<\/p>\n<p><strong>Unsere Produkte:<\/strong><\/p>\n<ul>\n<li><strong>Spherolyte\u00ae Cu UF5<\/strong>: Schnellstes Cu-Pillar Plating mit hervorragenden Homogenit\u00e4ten<\/li>\n<li><strong>Spherolyte\u00ae Cu UF3<\/strong>: Reinste Performance f\u00fcr Cu-Strukturen wie RDL und \u00b5-Via <\/li>\n<li><strong>Promobond\u00ae AP2<\/strong>: Haftvermittler f\u00fcr die n\u00e4chste Generation von Packaging Anwendungen<\/li>\n<li><strong>Spherolyte\u00ae Ni<\/strong>: Effektive Sperrschicht zwischen Lot und Cu zur Vermeidung von Hohlr\u00e4umen<\/li>\n<li><strong>Spherolyte\u00ae SnAg<\/strong>: Zuverl\u00e4ssigste Interconnect L\u00f6tanwendungen mit 2 % Ag<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Doppelseitige Metallisierung f\u00fcr Leistungschips wie z.B. IGBT, MOSFET usw.&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-5552 size-medium\" src=\"\/wp-content\/uploads\/2018\/07\/multiplate-july-16-2018.jpg\" alt=\"Atotech\" width=\"300\" height=\"201\" \/>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<p><strong>Ihre Anforderungen:<\/strong><\/p>\n<p>Moderne IGBT und Leistungs-MOSFET erfordern eine Metallisierung auf beiden Seiten der Wafer. Das herk\u00f6mmliche Verfahren mit sequenzieller Beschichtung der Vorder- und anschlie\u00dfend der R\u00fcckseite sorgt h\u00e4ufig f\u00fcr Spannungen und Verformungen w\u00e4hrend der Waferbearbeitung. D\u00fcnne Wafer, die zum Einbetten von Dies in Power Packages ben\u00f6tigt werden, sind daf\u00fcr besonders anf\u00e4llig. Daher ist eine wirksame Reduzierung von Spannungen und Verformungen w\u00e4hrend der Waferbearbeitung notwendig<\/p>\n<p><strong>Unsere L\u00f6sung:<\/strong><\/p>\n<p>Wir bieten ein Alternativverfahren \u2013 gleichzeitige doppelseitige Cu-Beschichtung der Vorder- und R\u00fcckseite zur wirksamen Reduzierung der Spannung und Verformung durch:<\/p>\n<ul>\n<li>Individuelle Steuerung der Cu-Schichtdicke auf Vorder- und R\u00fcckseite<\/li>\n<li>Verarbeitungsm\u00f6glichkeit von Taiko-Wafern<\/li>\n<li>Kurzer Prozessablauf<\/li>\n<li>Anlagen und Chemikalien aus einer Hand<\/li>\n<\/ul>\n<p><strong>Unsere Produkte:<\/strong><\/p>\n<p><strong>MultiPlate\u00ae and Spherolyte\u00ae MD2<\/strong>: Unser \u201cDreamteam\u201c f\u00fcr Leistungs-IC<\/p>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Pad-Metallisierung und RDL-Housing&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-23117 size-full\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-3.jpg\" alt=\"Atotech\" width=\"230\" height=\"389\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-3.jpg 230w, https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-3-177x300.jpg 177w\" sizes=\"(max-width: 230px) 100vw, 230px\" \/><\/p>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<p><strong>Ihre Anforderungen:<\/strong><\/p>\n<p>Drahtbonden oder L\u00f6ten \u2013 welche Oberfl\u00e4che ist f\u00fcr Ihre Packaging-Anforderungen am besten geeignet? Und wie bekommt man den gew\u00fcnschten Metall-Stack auf den Al- oder Cu-Wafer? Ist dies auch in der Massenproduktion m\u00f6glich? Ist das Verfahren zuverl\u00e4ssig, bew\u00e4hrt in der Automobilbranche oder in noch anspruchsvolleren Umgebungen? All dies sind die typischen Fragen und Herausforderungen, die letztlich bestimmen, welche Metalle f\u00fcr First-Level-Verbindungen verarbeitet werden sollen.<\/p>\n<p><strong>Unsere L\u00f6sung:<\/strong><\/p>\n<ul>\n<li>Universelle Vorbehandlung, d.h. Zinkatierungsprozesse f\u00fcr alle Al-Legierungen und universelle Aktivierung f\u00fcr Cu-Wafer<\/li>\n<li>Automotive-erprobte ENEPIG-Stacks (chemisch Ni &#8211; chemisch Pd &#8211; Sudgold)<\/li>\n<li>Hochproduktive Prozesse f\u00fcr Nassprozess- anlagen, die 25 oder 50 Wafer auf einmal verarbeiten k\u00f6nnen.<\/li>\n<li>Cyanidfreie Verfahren<\/li>\n<li>Hochtemperaturfeste tern\u00e4re Ni-Schichten<\/li>\n<li>Reine Pd-Schichten f\u00fcr erh\u00f6hte Zuverl\u00e4ssigkeit<\/li>\n<\/ul>\n<p><strong>Unsere Produkte:<\/strong><\/p>\n<ul>\n<li><strong>Xenolyte\u00ae Pd HS<\/strong>: Reines Pd f\u00fcr qualitativ hochwertige Drahtbondanwendungen<\/li>\n<li><strong>Xenolyte\u00ae Ni TR<\/strong>: Tern\u00e4re Ni-Schicht f\u00fcr hohe Temperaturfestigkeit<\/li>\n<li><strong>Xenolyte\u00ae Au CF2<\/strong>: Cyanidfreies Sudgoldverfahren<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Verbindungsmetallisierungsl\u00f6sungen f\u00fcr Logik-, Speicher- und Leistungs-IC&#8220; _builder_version=&#8220;4.16.1&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<\/p>\n<p><div class='one_fourth'>\n\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-23123 size-full\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-4-2.jpg\" alt=\"Atotech\" width=\"230\" height=\"339\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-4-2.jpg 230w, https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/el-sc-portfolio-4-2-204x300.jpg 204w\" sizes=\"(max-width: 230px) 100vw, 230px\" \/>\n\t\t\t\t<\/div> <div class='three_fourth et_column_last'>\n\t\t\t\t\t<p><strong>Ihre Anforderungen:<\/strong><\/p>\n<p>Verbindungstechnologien der n\u00e4chsten Generation erfordern extreme Leistungen von Nassmetallisierungsverfahren<\/p>\n<ul>\n<li>Kompatibel mit extrem d\u00fcnnen \u201eSeed Layern\u201c f\u00fcr BEOL-Kupferverbindungen in der Damascene-Technik<\/li>\n<li>Filling M\u00f6glichkeit f\u00fcr \u00d6ffnungen der Vorbeschichtung von weit unter 10 nm sowohl f\u00fcr Kupfer- als auch f\u00fcr Kobaltverbindungen<\/li>\n<li>Void-\/ Lunkerfreie, hochreine Cu- und Co-Schichten<\/li>\n<\/ul>\n<p>Von gr\u00f6\u00dfter Bedeutung ist die void-\/lunkerfreie F\u00fcllung der Verbindungen. Immer dichtere und komplexere Schaltverbindungen erfordern eine immer h\u00f6here Fertigungspr\u00e4zision.<\/p>\n<p><strong>Unsere L\u00f6sung: <\/strong><\/p>\n<ul>\n<li>Atotech bietet, nach neustem Stand der Technik, Chemikalien f\u00fcr die Nassmetallisierung von Cu- und Co-Verbindungen an.<\/li>\n<li>Extreme Reinheitsanforderungen werden von den von uns entwickelten Chemikalien m\u00fchelos erf\u00fcllt.<\/li>\n<li>F\u00fcr jeden Metallisierungsschritt sind L\u00f6sungen verf\u00fcgbar, die mit allen modernen ECD-Plattformen kompatibel sind.<\/li>\n<\/ul>\n<p><strong>Unsere Produkte:<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/everplate-2xt\/\"><strong>Everplate\u00ae 2XT<\/strong><\/a>: Hochleistungsf\u00e4higes Additivpaket f\u00fcr die Cu \u2013Filling Technologie mittels zukunftsorientierter Damascene-Technik<\/li>\n<li><strong>Atomplate\u00ae Co<\/strong>: Elektrolytisches, reines Co f\u00fcr MEOL-Verbindungstechnologien, welches ein echtes Bottom-up-Filling erm\u00f6glicht<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div><\/p>\n<p>[\/et_pb_accordion_item][\/et_pb_accordion][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;atotech-recommended-products background-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_color_bottom=&#8220;#5c94d4&#8243; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2:Featured products&#8220; _builder_version=&#8220;4.16&#8243; text_text_color=&#8220;#e02b20&#8243; header_text_color=&#8220;#e02b20&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2 style=\"text-align: left;\">Featured products<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Spherolyte<sup>\u00ae<\/sup> Cu UF5&#8243; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/06\/UF5-Feat-im-final-1.png&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Spherolyte Cu UF5&#8243; _builder_version=&#8220;4.19.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/products\/electronics\/semiconductor\/spherolyte-cu-uf5\/&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Schnellstes -Cu-Pillar Plating mit hervorragenden Homogenit\u00e4ten<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/spherolyte-cu-uf5\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_code admin_label=&#8220;Abstand&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_code][et_pb_blurb title=&#8220;Spherolyte<sup>\u00ae<\/sup> Cu UF3 &#8220; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/05\/feautured-image-v1.jpg&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Spherolyte&#8220; _builder_version=&#8220;4.16.1&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/spherolyte-cu-uf3\/&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Universelle Plating Chemie f\u00fcr Cu Strukturen wie RDL und Micro Via Filling<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/spherolyte-cu-uf3\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_blurb title=&#8220;Everplate 2XT<sup>\u00ae<\/sup>&#8220; image=&#8220;\/wp-content\/uploads\/2016\/02\/Atomplate_Plus_1.jpg&#8220; icon_placement=&#8220;left&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;Everplate 2X Plus&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/everplate-2x-plus\/&#8220; use_border_color=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Advanced additive suite for extreme damascene gap fill performance<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"everplate-2x-plus\">Read more<\/a><\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Promobond<sup>\u00ae<\/sup> AP2 &#8220; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/06\/Feat-ima-Prom-final.png&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Promobond\u00ae AP2&#8243; _builder_version=&#8220;4.19.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/products\/electronics\/semiconductor\/promobond-ap2\/&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Haftvermittler f\u00fcr die n\u00e4chste Generation von Packaging Anwendungen<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/promobond-ap2\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_code admin_label=&#8220;Abstand&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_code][et_pb_blurb title=&#8220;Xenolyte<sup>\u00ae<\/sup> Ni TR&#8220; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/05\/NI-TR-feat-image-v1.jpg&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Xenolyte&#8220; _builder_version=&#8220;4.19.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/products\/electronics\/semiconductor\/xenolyte-ni-tr\/&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Verbesserte Chemie f\u00fcr breit einsetzbare und stressarme stromlose Ni-Abscheidung<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/xenolyte-ni-tr\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_blurb title=&#8220;MultiPlate<sup>\u00ae<\/sup>&#8220; image=&#8220;\/wp-content\/uploads\/2016\/02\/multiplate-highlight-preview.jpg&#8220; icon_placement=&#8220;left&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;Multiplate&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/multiplate-and-spherolyte-cu-md2\/&#8220; use_border_color=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Double sided metallization for power chips (IGBT, MOSFETS, &#8230;)<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"\/semiconductor-technology\/multiplate-and-spherolyte-cu-md2\/\">Read more<\/a><\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;off|off|off&#8220; admin_label=&#8220;section&#8220; _builder_version=&#8220;4.16&#8243; inner_width_tablet=&#8220;50px&#8220; inner_max_width_tablet=&#8220;50px&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; z_index_tablet=&#8220;500&#8243; da_disable_devices=&#8220;off|off|off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row module_class=&#8220;revamp-header small&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Product video&#8220; _builder_version=&#8220;4.16.1&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Spherolyte\u00ae Cu UF 5<\/h2>\n<h3>Schnellstes Cu-Pillar Plating mit hervorragenden Homogenit\u00e4ten<\/h3>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;2_3,1_3&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_video src=&#8220;https:\/\/www.youtube.com\/watch?v=qGjfkuZjemo&#038;list=PL4F9Bq-5JeJXQGVMBoJzhkamo_LHUOsVp&#038;index=11&#8243; disabled_on=&#8220;off|off|off&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_video][et_pb_code disabled_on=&#8220;on|on|on&#8220; _builder_version=&#8220;4.16&#8243; _module_preset=&#8220;default&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<div itemscope itemtype=\"https:\/\/schema.org\/VideoObject\"><meta itemprop=\"uploadDate\" content=\"Fri Feb 12 2021 08:31:54 GMT+0100 (Mitteleurop\u00e4ische Normalzeit)\"\/><meta itemprop=\"name\" content=\"Atotech Imagefilm Trailer Plus  Hd1080 Website\"\/><meta itemprop=\"duration\" content=\"PT3M56.164S\" \/><meta itemprop=\"thumbnailUrl\" content=\"https:\/\/content.jwplatform.com\/thumbs\/IT8xwgPA-1920.jpg\"\/><meta itemprop=\"contentUrl\" content=\"https:\/\/content.jwplatform.com\/videos\/IT8xwgPA-lij2vLIm.mp4\"\/><script src=\"https:\/\/cdn.jwplayer.com\/players\/IT8xwgPA-ShbLpCCE.js\"><\/script><\/div>\n<p>[\/et_pb_code][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Video description&#8220; _builder_version=&#8220;4.16.1&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Mit <b>Spherolyte\u00ae Cu UF 5<\/b> sind wir mehr als bereit, die h\u00e4rtesten Anforderungen an die Gleichm\u00e4\u00dfigkeit mit einem neuen, reinen und gleichm\u00e4\u00dfigen Kupfers\u00e4ulen-Abscheidungsprozess zu erf\u00fcllen, der mit den h\u00f6chsten Beschichtungsgeschwindigkeiten arbeiten kann.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;off|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;Systems&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_3,2_3&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;\/wp-content\/uploads\/2016\/03\/sc-cleanroom.jpg&#8220; alt=&#8220;High-purity chemistry manufacturing&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.16&#8243; animation_style=&#8220;slide&#8220; animation_direction=&#8220;left&#8220; animation_duration=&#8220;500ms&#8220; animation_intensity_slide=&#8220;10%&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; animation=&#8220;left&#8220; sticky=&#8220;off&#8220; always_center_on_mobile=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;High-purity chemistry manufacturing&#8220; _builder_version=&#8220;4.19.2&#8243; text_font_size=&#8220;17&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Hochreine Prozesschemikalien<\/h2>\n<h3>Reinraumfertigung f\u00fcr die Halbleiterindustrie<\/h3>\n<p>Unsere hochreinen Chemikalien werden nach den aktuellsten und strengsten Vorgaben der Halbleiterindustrie gefertigt. Die Herstellung und Reinraumabf\u00fcllung erfolgt am Standort Neuruppin auf einer Fl\u00e4che von 1.500 m\u00b2 in einer geschlossen Produktionsumgebung auf vollautomatisierten Fertigungsanlagen. Dies garantiert eine effiziente, umweltfreundliche, sichere und wirtschaftliche Produktion.<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/high-purity-chemistry-manufacturing\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;movies&#8220; module_class=&#8220;background-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;&#8220; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2: Movies&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;center&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Movies<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;2_3,1_3&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_video src=&#8220;\/wp-content\/uploads\/2018\/07\/Multiplate_Kurzfassung_Logo_2018_Final_360p.mp4&#8243; image_src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/07\/multiplate-video-teaser-image-02.jpg&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_video][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Multiplate&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; text_orientation=&#8220;center&#8220; module_alignment=&#8220;center&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h3 style=\"text-align: left;\">MultiPlate<sup>\u00ae<\/sup><\/h3>\n<h4 style=\"text-align: left;\">An innovative electrochemical plating system for next generation packaging technologies<\/h4>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;off|off|off&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;revamp-quote backgrounds-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_width_bottom=&#8220;1px&#8220; border_color_bottom=&#8220;#5c94d4&#8243; transparent_background=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; module_class=&#8220;centered-textblock background-1&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Zitat (Did you know)&#8220; module_class=&#8220;quote-area&#8220; _builder_version=&#8220;4.16.1&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>\u201cWe continuously strive to provide best-in-class metallization solutions to the semiconductor industry. This makes us a valuable partner for the development of next generation technologies.&#8220;<\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Dr. Christian Ohde<br \/>Global Product Director Semiconductor Advanced Packaging jmÌìÌÃ¹ÙÍø at Atotech Germany<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2021\/02\/CO-scaled.jpg&#8220; title_text=&#8220;CO&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;success-stories&#8220; module_class=&#8220;atotech-successstories&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#dd4a4a&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Did you know?&#8220; image=&#8220;\/wp-content\/uploads\/2016\/03\/multiplate.png&#8220; admin_label=&#8220;Did you know&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#ffffff&#8220; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; text_orientation=&#8220;center&#8220; background_layout=&#8220;dark&#8220; max_width_tablet=&#8220;50px&#8220; custom_margin=&#8220;50||50|&#8220; custom_padding=&#8220;||50|&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>\nWith the addition of MultiPlate<sup>\u00ae<\/sup>, we have the unique position of offering a one-stop shop when it comes to electroplating, providing high purity chemistry, plating equipment, and process development for ECD packaging.<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;revamp-quote&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_width_bottom=&#8220;1px&#8220; border_color_bottom=&#8220;#5c94d4&#8243; transparent_background=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; module_class=&#8220;centered-textblock background-4 &#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Did you know&#8220; module_class=&#8220;quote-area&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Did you know?<\/h2>\n<p>With the addition of MultiPlate<sup>\u00ae<\/sup>, we have the unique position of offering a one-stop shop when it comes to electroplating, providing high purity chemistry, plating equipment, and process development for ECD packaging.<\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8220;4.16&#8243; width=&#8220;80%&#8220; max_width=&#8220;1080px&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>David Lui, Senior Corporate Support Manager (Integrity Officer), Atotech China<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/05\/th-filled-square.jpg&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;jmÌìÌÃ¹ÙÍø&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Recent publications&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2 style=\"text-align: center;\">Recent publications<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;blurb-list background-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;||100px|&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_color_bottom=&#8220;#5c94d4&#8243; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2: Recent publications&#8220; _builder_version=&#8220;4.16&#8243; text_text_color=&#8220;#e02b20&#8243; header_text_color=&#8220;#e02b20&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2 style=\"text-align: left;\">Recent publications<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;An innovative plating system for next generation packaging technologies&#8220; url=&#8220;\/wp-content\/uploads\/2017\/09\/An-innovative-plating-system-for-next-generation-packaging-technologies.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;An innovative plating system for next generation packaging technologies&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>This article was originally published in Silicon Semiconductor.<br \/>As device geometries continue to shrink, semiconductor packaging technologies face constant challenges to remain relevant and economically viable. Need of the hour is to develop innovative approaches that cost-effectively address the emerging requirements. This article will explore the current challenges for advanced packaging and how they may be overcame by rethinking traditional manufacturing approaches.<\/p>\n<p>2016, PDF, 3,400 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Fan-out packaging: a key enabler for optimal performance in mobile devices&#8220; url=&#8220;\/wp-content\/uploads\/2017\/09\/Fan-out-packaging-a-key-enabler-for-optimal-performance-in-mobile-devices.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;Fan-out packaging: a key enabler for optimal performance in mobile devices&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>This article was originally published in Chip Scale Review.<br \/>The emergence of FOWLP has been directly linked to satisfying the requirements for consumer electronics, and particularly those of mobile devices. This article will explore the drivers behind fan-out packaging, the key processing challenges, and the requirements at the application level. It will also discuss why fan-out is the ideal packaging technology for future generation mobile devices, and will present a turnkey solution for manufacture within both wafer and panel formats.<\/p>\n<p>2017, PDF, 1,200 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Next-generation copper pillar plating technologies&#8220; url=&#8220;\/wp-content\/uploads\/2017\/09\/Next-generation-copper-pillar-plating-technologies.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;Next-generation copper pillar plating technologies&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>This article was originally published in Chip Scale Review.<br \/>As the industry moves towards smaller, faster devices, there is mounting pressure on all members of the supply chain to enable higher performance at lower cost.<br \/>The limitations of Moore\u2019s Law are evident and advanced technology nodes are no longer providing a significant cost benefit. As a result, the industry has shifted its focus to advanced packaging as a means for providing enhanced performance and lower costs, i.e. \u201cMore than Moore.&#8220;<br \/>The primary drivers for this shift are improved performance, more functionality, and cost reduction. This article will discuss how these three drivers have led to the emergence of flip-chip packaging using pillars and the current and future challenges for Cu pillar technology.<\/p>\n<p>2016, PDF, 560 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;The Interactions between SNAGCU Solder and NI(P)\/AU, NI(P)\/PD\/AU UBMS&#8220; url=&#8220;\/wp-content\/uploads\/2016\/08\/The_INTEREATIONS_between_SNAGCU_Solder_and_NIAU_NIPDAU_UBMS.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;The Interactions between SNAGCU Solder and NI(P)\/AU, NI(P)\/PD\/AU UBMS&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Investigations of intermetallic reactions between the Sn3.5Ag0.5Cu solder and two different UBM structures, Ni(P)\/Au and Ni(P)\/Pd\/Au.<\/p>\n<p>2015, PDF, 2,250 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; disabled_on=&#8220;on|on|on&#8220; _builder_version=&#8220;4.16&#8243; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Surface Pre-treatment: A Vital Prerequisite for Successful Copper Plating&#8220; url=&#8220;\/wp-content\/uploads\/2018\/07\/Atotech_IMS_HSEQ_Policy_2018_4.0.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#dd4a4a&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Surface Pre-treatment: A Vital Prerequisite for Successful Copper Plating&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#dd3333&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>This article was originally published in Global SMT &amp; Packaging, Vol.16 No. 3 on page 38. It highlights CupraPro S8, a new acid cleaning pre-treatment which is designed to offer high flexibility for the substrates to be pre-treated. Pre-treatment by acid cleaners is a vital process step in order to grant successful copper plating within the PCB production. The described pre-treatment is intended for multiple use, i.e. for MLB as well as HDI applications in hoist type equipment.<\/p>\n<p>2016, PDF, 6.500 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Copper filling of blind micro vias and through holes using reverse pulse plating&#8220; url=&#8220;\/wp-content\/uploads\/2018\/07\/Atotech_IMS_HSEQ_Policy_2018_4.0.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#dd4a4a&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Copper filling of blind micro vias and through holes using reverse pulse plating&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#dd3333&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>This article describes the different techniques of via filling and their characteristics. It points out the advantages of reverse pulse plating and how the technology was modified to approach new market requirements such as thicker core substrates and laser drilling of through holes. The current capability of the system for inclusion free filling and the areas where development is ongoing are demonstrated.<\/p>\n<p>2014, PDF, 975 KB<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;movies&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2: Movies&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;center&#8220; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Movies<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; module_class=&#8220;portfolio-grid&#8220; _builder_version=&#8220;4.16&#8243; da_disable_devices=&#8220;off|off|off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;2_3,1_3&#8243; module_id=&#8220;portfolio&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Portfolio overview&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Electronics portfolio overview<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_4,1_4,1_4,1_4&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-surface-treatment.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/surface-treatment\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Surface treatment&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Surface treatment&#8220; _builder_version=&#8220;4.16&#8243; custom_margin=&#8220;-10px|||&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/surface-treatment\/" class='small-button smallblue'>Surface treatment<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-desmear-and-metallization.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/desmear-and-metallization\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Desmear and metallization&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Desmear and metallization&#8220; _builder_version=&#8220;4.16&#8243; custom_margin=&#8220;-10px|||&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/desmear-and-metallization\/" class='small-button smallblue'>Desmear and metallization<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-electrolytic-plating.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/electrolytic-plating\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Electrolytic plating&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Electrolytic plating&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/electrolytic-plating\/" class='small-button smallblue'>Electrolytic plating<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-final-finishing.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/final-finishing\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Final finishing&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Final finishing&#8220; _builder_version=&#8220;4.16&#8243; custom_margin=&#8220;-10px|||&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/final-finishing\/" class='small-button smallblue'>Final finishing<\/a>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_4,1_4,1_4,1_4&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-leadframe-and-connector.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/leadframe-and-connector\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Leadframe and connector&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Leadframe and connector&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/leadframe-and-connector\/" class='small-button smallblue'>Leadframe and connector<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-equipment.jpg&#8220; url=&#8220;https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Equipment&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Equipment&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/" class='small-button smallblue'>Equipment<\/a>\n<p>&nbsp;<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; 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