[et_pb_section fb_built=”1″ admin_label=”section” _builder_version=”4.17.6″ da_disable_devices=”off|off|off” global_colors_info=”{}” da_is_popup=”off” da_exit_intent=”off” da_has_close=”on” da_alt_close=”off” da_dark_close=”off” da_not_modal=”on” da_is_singular=”off” da_with_loader=”off” da_has_shadow=”on”][et_pb_row column_structure=”1_3,2_3″ admin_label=”row” _builder_version=”4.17.6″ background_size=”initial” background_position=”top_left” background_repeat=”repeat” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2022\/11\/SCEuropa_PNG.png” title_text=”SCEuropa_PNG” _builder_version=”4.18.0″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”2_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_text _builder_version=”4.18.0″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n
Berlin, November 2 \u2013 MKS\u2019 Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. \u2013 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor).<\/p>\n
The company\u2019s Semiconductor Advanced Packaging and Lead Frame Package experts will be highlighting latest manufacturing solutions for ENEPIG for pad metallization and RDL housing, pillar, RDL and lead frame applications, as well as be available for detailed discussions around other production trends at booth 165 in hall C1.<\/p>\n
ENEPIG for pad metallization and RDL housing: Pillar applications: RDL applications: Leadframe applications: For more information on Semicon Europa, please visit: Overview<\/a> | SEMICON Europa<\/a><\/p>\n About jmÌìÌùÙÍøInstruments<\/strong><\/p>\n jmÌìÌùÙÍøInstruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, advanced electronics and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world\u2019s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed and feature enhancement for optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at\u00a0www.mks.com<\/a>.<\/p>\n <\/p>\n About MKS\u2019 Atotech<\/strong><\/p>\n Atotech, a brand within the Materials Solutions Division of jmÌìÌùÙÍøInstruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech\u2019s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances.<\/p>\n With its well-established innovative strength and industry-leading global TechCenter network, jmÌìÌùÙÍødelivers pioneering solutions through its Atotech brand \u2013 combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com<\/a>.<\/p>\n [\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":" Berlin, November 2 \u2013 MKS\u2019 Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. \u2013 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor). The company\u2019s Semiconductor Advanced Packaging and […]<\/p>\n","protected":false},"author":43,"featured_media":81420,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":5,"footnotes":""},"categories":[113,108],"tags":[],"class_list":["post-87424","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn","category-tradeshows-events-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87424","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/43"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=87424"}],"version-history":[{"count":1,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87424\/revisions"}],"predecessor-version":[{"id":87425,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87424\/revisions\/87425"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/81420"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=87424"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=87424"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=87424"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
<\/em><\/strong>Xenolyte\u00ae Ni:<\/strong> Electroless Ni plating for all requirements
Xenolyte\u00ae Au: <\/strong>Reliable immersion and autocatalytic Au solutions
Xenolyte\u00ae Pd HS:<\/strong> Pure electroless Pd deposits for high reliabilities<\/p>\n
<\/em><\/strong>Spherolyte\u00ae Cu UF 5:<\/strong> Tailorable and pure high-speed copper pillar plating
Spherolyte\u00ae Ni:<\/strong> All liquid component ECD Ni electrolyte for highly uniform plating
Spherolyte\u00ae SnAg: <\/strong>High-speed SnAg for lead-free, pure and uniform solder bump plating<\/p>\n
<\/em><\/strong>Spherolyte\u00ae Cu UF 3: <\/strong>Copper RDL process for purest line plating and micro via filling
Promobond\u00ae<\/strong> AP2: <\/strong>Adhesion promoter for reliability improvement of next-generation Cu deposits<\/p>\n
<\/em><\/strong>AgPrep: <\/strong>Ultimate non-etching adhesion promoter for silver surfaces
ppfPrep: <\/strong>NEAP for excellent adhesion and significant cost savings<\/p>\n