[et_pb_section fb_built=”1″ admin_label=”section” _builder_version=”4.17.6″ da_disable_devices=”off|off|off” global_colors_info=”{}” da_is_popup=”off” da_exit_intent=”off” da_has_close=”on” da_alt_close=”off” da_dark_close=”off” da_not_modal=”on” da_is_singular=”off” da_with_loader=”off” da_has_shadow=”on”][et_pb_row column_structure=”1_3,2_3″ admin_label=”row” _builder_version=”4.17.6″ background_size=”initial” background_position=”top_left” background_repeat=”repeat” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2023\/01\/Logo.png” title_text=”Logo” _builder_version=”4.19.2″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”2_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_text _builder_version=”4.19.2″ _module_preset=”default” hover_enabled=”0″ global_colors_info=”{}” sticky_enabled=”0″]<\/p>\n
Berlin, January 16 \u2013 The MKS\u2019 Atotech and ESI teams are pleased to invite you and meet at this year\u2019s IPC APEX EXPO in San Diego, California from January 24 to 26. Our local and global team members will be at booth 709 to discuss this year\u2019s technical papers and related research findings, as well as provide you with the latest insights on new products and solutions for your manufacturing challenges.<\/p>\n
Product highlights this year include:<\/strong><\/p>\n Uniplate\u00ae:<\/strong> Next generation horizontal plating line Papers at IPC APEX EXPO Technical Conference 2023:<\/strong><\/p>\n Printed Board Plating and Finishes 1 – <\/strong>Jan 24<\/strong> 10:30 AM \u2013 12:00 PM Printed Board Plating and Finishes 2<\/strong> – Jan 24<\/strong> 1:30 PM \u2013 3:00 PM Printed Board Material Innovations<\/strong> – Jan 24<\/strong> 3:30 PM \u2013 5:00 PM Printed Board Material Innovations<\/strong> – Jan 25<\/strong> 8:30 AM \u2013 10:00 AM For more information on IPC APEX EXPO please visit: Homepage | IPC APEX EXPO 2023<\/a><\/p>\n <\/p>\n About jmÌìÌùÙÍøInstruments<\/strong><\/p>\n jmÌìÌùÙÍøInstruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, advanced electronics and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world\u2019s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed and feature enhancement for optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at\u00a0www.mks.com<\/a>.<\/p>\n [\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":" Berlin, January 16 \u2013 The MKS\u2019 Atotech and ESI teams are pleased to invite you and meet at this year\u2019s IPC APEX EXPO in San Diego, California from January 24 to 26. Our local and global team members will be at booth 709 to discuss this year\u2019s technical papers and related research findings, as well […]<\/p>\n","protected":false},"author":43,"featured_media":83934,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":8,"footnotes":""},"categories":[113,108],"tags":[],"class_list":["post-87422","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn","category-tradeshows-events-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87422","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/43"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=87422"}],"version-history":[{"count":1,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87422\/revisions"}],"predecessor-version":[{"id":87423,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/87422\/revisions\/87423"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/83934"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=87422"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=87422"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=87422"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
BondFilm\u00ae HP:<\/strong> Unmatched I\/L bonding process for the most demanding bonding applications
Cupracid\u00ae TP5: <\/strong>Highest throwing power process excellent reliability
Aurotech\u00ae G-Bond 3<\/strong>: New gold electrolyte with autocatalytic properties & non-toxic stabilization
ViaKing\u00ae:<\/strong> Direct\u00a0metallization\u00a0process based on graphite
CapstoneTM<\/sup>:<\/strong> High-performance breakthrough productivity for flex PCB UV drilling
GeodeTM<\/sup>:<\/strong>\u00a0 High-precision CO2<\/sub> via drilling for HDI PCB manufacturing and IC packaging<\/p>\n
\u201cA novel copper via filling electrolyte for plating at high current densities for IC-Substrates\u201d
Speaker:<\/strong> Mustafa \u00d6zk\u00f6k | Global Product Manager Panel and Pattern Plating<\/p>\n
\u201cEnabling Non-toxic Stabilization for Mixed Reaction Gold Electrolytes\u201d
Speaker:<\/strong> Dr. Britta Schafsteller | Global Product Manager Selective Finishing<\/p>\n
\u201cHybrid Adhesion Enhancement Systems & Quality Control for low loss PCB Inner Layer bonding\u201d
Speaker:<\/strong> Christopher Seidemann |\u00a0Global Product Manager<\/p>\n
\u201cControlling Recrystallisation in Plated Layers Through the Use of Additives\u201d
Speaker:<\/strong> Roger Massey | Technical Marketing Manager, Atotech Group<\/p>\n