{"id":87416,"date":"2023-03-14T11:26:33","date_gmt":"2023-03-14T10:26:33","guid":{"rendered":"https:\/\/www.atotech.com\/mks-instruments-introduces-industry-leading-integrated-approach-to-creating-solutions-for-complex-package-substrate-manufacturing-requirements-and-roadmaps\/"},"modified":"2023-03-22T09:03:08","modified_gmt":"2023-03-22T08:03:08","slug":"mks-instruments-introduces-industry-leading-integrated-approach-to-creating-solutions-for-complex-package-substrate-manufacturing-requirements-and-roadmaps","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/mks-instruments-introduces-industry-leading-integrated-approach-to-creating-solutions-for-complex-package-substrate-manufacturing-requirements-and-roadmaps\/","title":{"rendered":"jmÌìÌùÙÍøinstruments introduces industry leading integrated approach to creating solutions for complex package substrate manufacturing requirements and roadmaps"},"content":{"rendered":"

[et_pb_section fb_built=”1″ admin_label=”section” _builder_version=”4.20.1″ da_disable_devices=”off|off|off” locked=”off” global_colors_info=”{}”][et_pb_row column_structure=”1_3,2_3″ admin_label=”row” _builder_version=”4.20.1″ background_size=”initial” background_position=”top_left” background_repeat=”repeat” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2023\/03\/MicrosoftTeams-image-3.png” title_text=”MicrosoftTeams-image (3)” align_tablet=”center” align_phone=”” align_last_edited=”on|desktop” _builder_version=”4.20.1″ animation_style=”slide” animation_direction=”left” animation_duration=”500ms” animation_intensity_slide=”10%” z_index_tablet=”500″ locked=”off” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”2_3″ _builder_version=”4.16″ custom_padding=”|||” global_colors_info=”{}” custom_padding__hover=”|||”][et_pb_text admin_label=”Text” _builder_version=”4.20.1″ background_size=”initial” background_position=”top_left” background_repeat=”repeat” global_colors_info=”{}”]<\/p>\n

Unveils significant investment in its Yokohama TechCenter (YTC) during the grand expansion ceremony<\/strong><\/p>\n

Yokohama, Japan, March 14, 2023:<\/strong> jmÌìÌùÙÍøInstruments, Inc. (NASDAQ: MKSI) (\u201cMKS\u201d), a global provider of technologies that transform our world, today unveiled a significant investment in its Yokohama Technical Center (\u201cYTC\u201d) in Japan, which will enable an industry leading integrated approach to creating solutions for complex package substrate manufacturing, satisfying current requirements as well as those needed for future roadmaps.<\/p>\n

The YTC is an integral part of the most comprehensive portfolio of global TechCenters in the industry. These TechCenters combine unique analytical capabilities, state of the art full scale equipment, and highly proficient expert teams to conduct extensive research and development, providing world-class service to more than 8,000 customers around the globe. Working closely with customers and industry partners helps anticipate the industry\u2019s future requirements, which in turn enables jmÌìÌùÙÍøto help customers stay ahead in a rapidly changing environment.<\/p>\n

The recent investment in the YTC delivers the latest capabilities for the production of next generation package substrates. Offering a unique combination, the YTC utilizes dedicated lasers, optics, and motion systems for high precision, high-speed via formation in ABF build-up laminates, in combination with the latest process chemistry and equipment for desmear and electroless copper metallization. Using the latest Equalized Curtain Flow (ECF) plating tool, the YTC is able to support customers in their yield optimization and next generation process development for advanced packaging applications.<\/p>\n

During the YTC Expansion Ceremony, Dr. John T.C. Lee, President and CEO of jmÌìÌùÙÍøInstruments, escorted visitors around the state-of-the-art facility showcasing the two new systems, the ESI GeodeTM<\/sup> A CO2<\/sub> laser system and the Atotech G-Plate\u00ae plating tool, as well as demonstrating the Vitrocoat\u00ae process for Plating on Glass (PoG).<\/p>\n

 <\/p>\n