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Berlin, March 20<\/strong>\u00a0– Today, jmÌìÌùÙÍøInstruments announced its participation in the upcoming CPCA Show 2023, the international electronic circuits exhibition in Shanghai, China held from March 22-24, 2023. jmÌìÌùÙÍøwill be present with representatives from two of its strategic brands, Atotech and ESI, and present its latest products and manufacturing solution for printed circuit board and package substrate manufacturing.<\/p>\n Product experts from overseas will be joining the local team and be available to discuss the latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth 7T26 and this year\u2019s product highlights include:<\/p>\n V-Plate\u00ae:<\/strong> The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates<\/p>\n InPro\u00ae SAP6: <\/strong>The new high-end electrolyte for vertical processing of next-generation package substrates<\/p>\n New Uniplate\u00ae: <\/strong>The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrates manufacturing<\/p>\n Printoganth\u00ae MV TP2:<\/strong> Next-generation electroless copper for fine-line SAP applications<\/p>\n BondFilm\u00ae EX:<\/strong> New bonding enhancement solution for low signal loss high-frequency applications<\/p>\n PallaBond\u00ae:<\/strong> Direct pure EPAG for high-end circuitry and reliability application<\/p>\n CapstoneTM<\/sup>:<\/strong> Flex PCB UV drilling tool for high-performance breakthrough productivity<\/p>\n