[et_pb_section bb_built=”1″ admin_label=”section”][et_pb_row admin_label=”Row” background_position=”top_left” background_repeat=”repeat” background_size=”initial”][et_pb_column type=”1_3″][et_pb_image admin_label=”Image” src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2017\/06\/NovaBondIT_PM_2.jpg” show_in_lightbox=”off” url_new_window=”off” sticky=”off” align=”left” force_fullwidth=”off” always_center_on_mobile=”on” border_style=”solid” alt=”Printoganth\u00ae U CF” title_text=”Printoganth\u00ae U CF” use_overlay=”off” _builder_version=”3.0.49″ \/][et_pb_text admin_label=”Text” background_layout=”light” text_orientation=”left” border_style=”solid” background_position=”top_left” background_repeat=”repeat” background_size=”initial” _builder_version=”3.0.49″]<\/p>\n
Surface roughness after treatment with NovaBond\u00ae<\/sup> IT<\/p>\n [\/et_pb_text][\/et_pb_column][et_pb_column type=”2_3″][et_pb_text admin_label=”Text” background_layout=”light” text_orientation=”left” text_font_size=”18″ border_style=”solid” background_position=”top_left” background_repeat=”repeat” background_size=”initial” _builder_version=”3.0.49″]<\/p>\n Atotech presents NovaBond\u00ae<\/sup> IT at the JPCA Show 2017<\/strong><\/p>\n BERLIN, 2 June, 2017: Atotech will introduce NovaBond\u00ae<\/sup> IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding and soldermask pretreatment, to press and media at this year\u2019s JPCA Show Press Forum. Traditionally, JPCA will be held at Tokyo Big Sight in Tokyo, Japan, this time from June 7 to 9, 2017.<\/p>\n At the Press Forum on June 8 from 10:30 to 11:00 am, Toshio Honda, Chief Product Marketing Application Engineer at Atotech Japan K.K., will present NovaBond\u00ae<\/sup> IT, a new process ideally suited for use on industry-standard ABF and solderresist materials, leading to excellent bonding strength performance values on both material types. NovaBond\u00ae IT combines the benefits of a non-etching surface treatment with peel strength and thermal reliability on standard ABF build-up films as well as dry film soldermasks. The process can be directly applied on the copper surface and promotes the formation of nano-dimensional copper oxide structures thereby promoting mechanical adhesion to the bonded material.<\/p>\n Additionally, Atotech will present the following two topics at JPCA\u2019s New Product Introduction Forum (NPI):<\/p>\n<\/p>\n Atotech’s team of experts will be at JPCA Show 2017, at booth number 7A-04 (East Hall 7), from June 7 to 9, and is looking forward to discuss industry roadmaps, new manufacturing requirements, and many new products for advanced HDI using\n
\n“Electrolytic plating solutions for advanced IC substrates and beyond”<\/li>\n
\n“Horizontal electroless copper solutions for next generation package substrates\u201d<\/li>\n<\/p>\n
mSAP \/ amSAP (such as BondFilm\u00ae<\/sup> LDD MSAP, Printoganth\u00ae<\/sup> U Plus or Inpulse\u00ae<\/sup> 2MSAP (H) \/ InPro\u00ae THF (V)) and IC packaging using panel or wafer format (Printoganth\u00ae<\/sup> PLP, InPro\u00ae<\/sup> PLP, Pallabond\u00ae<\/sup> or the MultiPlate\u00ae<\/sup> processes Innolyte\u00ae<\/sup> P \/ PLP).<\/p>\n