{"id":45772,"date":"2019-01-22T09:03:26","date_gmt":"2019-01-22T08:03:26","guid":{"rendered":"https:\/\/www.atotech.com\/atotech-to-present-a-series-of-new-processes-at-the-ipc-apex-expo-2019-electronics\/"},"modified":"2019-05-16T12:29:03","modified_gmt":"2019-05-16T10:29:03","slug":"atotech-to-present-a-series-of-new-processes-at-the-ipc-apex-expo-2019-electronics","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/atotech-to-present-a-series-of-new-processes-at-the-ipc-apex-expo-2019-electronics\/","title":{"rendered":"jmÌìÌùÙÍø to present a series of new processes at the IPC APEX Expo 2019 || Electronics"},"content":{"rendered":"

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Printoganth\u00ae T1: Horizontal high throw electroless copper for amSAP technology<\/p>\n

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Berlin, 23 January, 2019:<\/strong> Atotech is one of the world\u2019s leading suppliers of specialty chemicals and equipment for the printed circuit board, package substrate and semiconductor industry. At one of the industry\u2019s premier events, the IPC APEX Expo held at the San Diego Convention Center in San Diego, USA, from January 26 to 31, 2019, the company will exhibit and present on several new product developments.<\/p>\n

On Tuesday, January 29, from 1:30 to 3:00 p.m.<\/strong>, Moody Dreiza, Business Director for Electronics, North America, at Atotech USA LLC, will present \u201cCopper Filling of Blind Microvias, Through Holes and Cu Pillar Plating – The Present and the Future\u201d in session S02 \u201cPCB fabrication \/ Plating I\u201d. \u201cI will describe the reasons for development and a roadmap of dimensions for copper filled through-holes, blind microvias and other copper plated structures on PCBs by presenting aspect ratios, dimensions and results of plated through-holes used today in high volume manufacturing for blind microvia and through-hole filling with electroplated copper,\u201d states Moody. His presentation will include feasibility studies of new electroplated structures for future applications such as copper pillar plating on IC-substrates.<\/p>\n

On Wednesday, January 30, from 10:30 a.m. to 12:00 p.m.<\/strong>, Roger Massey, Technical Marketing Manager at Atotech Group, will present \u201cDevelopments in Electroless Copper Processes to Improve Performance in amSAP Mobile Applications\u201d in session S13 \u201cPCB Fabrication and Plating II\u201d. In his presentation, Roger will highlight the benefits and robust performance of a newly developed electroless copper process for amSAP applications.<\/p>\n

On Wednesday, January 30, from 3:30 to 4:30 p.m.<\/strong>, Sandra Nelle, Product Manager for Surface Finishing at Atotech Group, will present \u201cDesigning a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability\u201d in session S23 \u201cPCB Surface Finishes II\u201d. Sandra will elaborate whether there are any \u2018value added\u2019 benefits to an HP ENIG. \u201cI will also use data generated by Design of Experiment (DOE) to elaborate the impact of electroless nickel variables in combination with traditional and cyanide-free immersion gold on recognized quality expectations,\u201d adds Sandra.<\/p>\n

Atotech experts will also be on hand to discuss the latest chemistry and equipment at booth 311. Atotech\u2019s latest products will be showcased at the booth, including:<\/p>\n