[et_pb_section bb_built=”1″ admin_label=”section”][et_pb_row admin_label=”Row”][et_pb_column type=”1_3″][et_pb_image admin_label=”Image” src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2017\/05\/FO-PackageonPackage.jpg” show_in_lightbox=”off” url_new_window=”off” animation=”left” sticky=”off” align=”left” force_fullwidth=”off” always_center_on_mobile=”on” use_border_color=”off” border_color=”#ffffff” border_style=”solid” alt=”FO- Package-on-Package example for advanced processor application ” title_text=”FO- Package-on-Package example for advanced processor application ” use_overlay=”off” \/][et_pb_text admin_label=”Text” background_layout=”light” text_orientation=”left” use_border_color=”off” border_color=”#ffffff” border_style=”solid”]<\/p>\n
FO- Package-on-Package example for advanced processor application
\nSource: Yole Development, \u201cFan-out packaging, technologies and market trends\u201d, Release 2016<\/p>\n
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BERLIN, 12. May, 2017:<\/strong> Atotech, a global leader in specialty plating chemicals, equipment and services will present its next generation plating technologies for FO-Panel Level Packaging (FO-PLP) at the upcoming ECTC 2017, held from May 30 to June 2, 2017, at the Walt Disney World Swan and Dolphin Resort in Florida, USA. Atotech\u2019s specialists\u2019 also co-authored work on fine pitch flip chip process technologies and 3D Cu-Cu and micro bump bonding technologies which will be presented as collaborative work at ECTCs program sessions.<\/p>\n In an interactive presentation on May 31, 2017, from 9 to 11 am, Ralph Zoberbier, Manager Equipment Sales and Marketing at Atotech Deutschland GmbH, will present next generation plating technologies for FO-Panel Level Packaging. In his presentation, Ralph Zoberbier will highlight the current manufacturing challenges in panel based packaging applications and present Atotech\u2019s latest technology developments and solutions on its MultiPlate\u00ae equipment and plating processes, dedicated for next generation FO-PLP.<\/p>\n Work co-authored by Atotech\u2019s specialists will be presented at the following program sessions:<\/p>\n In session 9, \u201cScaling Cu pillars to 20\u00b5m pitch and below: Strategic role of surface finish and barrier layers\u201d presents the first demonstration of Cu pillar interconnections at 20\u00b5m pitch, enabled by innovative interconnection designs and advances in surface finish metallurgies with precisely controlled and unique interfacial reactions. The novel surface finish metallurgy, EPAG was introduced in replacement of standard ENEPIG, limited to coarse wiring pitches due to the conventionally high thickness of its Ni layer. This key innovation, combined to the elimination of both the Ni barrier layer between Cu pillar and solder cap and the pre-reflow step, enabled, for the first time, formation of reliable Cu pillar joints with less than 7\u00b5m solder height, scalable to 20\u00b5m pitch.<\/p>\n The \u201cMorphology study of bimodal-particle-based all-copper interconnects formed at low sintering temperature\u201d in session 21 presents the main advantages of dip based, all-copper interconnect technologies. The compatibility of these technologies with different surface finishes is among the advantages discussed. The highlight is the compatibility of the novel surface finish EPAG, where resistance and shear strength are comparable, and in some cases, better than existing traditional surface finishes. The negative impacts associated with electroless nickel on fine pitch resolution and high frequency applications are resolved by the EPAG process.<\/p>\n To learn more about these technologies, visitors to the ECTC 2017 are invited to attend the presentations and discuss these and other topics with Atotech\u2019s specialists on-site.<\/p>\n\n