{"id":9785,"date":"2016-05-10T08:52:13","date_gmt":"2016-05-10T08:52:13","guid":{"rendered":"https:\/\/www.atotech.com\/panel-pattern-plating\/inpro-sap2\/"},"modified":"2023-10-19T18:10:25","modified_gmt":"2023-10-19T16:10:25","slug":"inpro-sap2","status":"publish","type":"page","link":"https:\/\/www.atotech.com\/cn\/products\/electronics\/electrolytic-plating\/inpro-sap2\/","title":{"rendered":"InPro<sup>\u00ae<\/sup> SAP2"},"content":{"rendered":"<p>[et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; fullwidth=&#8221;on&#8221; specialty=&#8221;off&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; padding_mobile=&#8221;off&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243; module_class=&#8221;Top&#8221;][et_pb_fullwidth_slider admin_label=&#8221;Hero Slider Small&#8221; show_arrows=&#8221;off&#8221; show_pagination=&#8221;off&#8221; auto=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; remove_inner_shadow=&#8221;off&#8221; background_position=&#8221;default&#8221; background_size=&#8221;default&#8221; top_padding=&#8221;100px&#8221; bottom_padding=&#8221;100px&#8221; hide_content_on_mobile=&#8221;off&#8221; hide_cta_on_mobile=&#8221;off&#8221; show_image_video_mobile=&#8221;off&#8221; custom_button=&#8221;off&#8221; button_letter_spacing=&#8221;0&#8243; button_use_icon=&#8221;default&#8221; button_icon_placement=&#8221;right&#8221; button_on_hover=&#8221;on&#8221; button_letter_spacing_hover=&#8221;0&#8243; auto_ignore_hover=&#8221;off&#8221; module_class=&#8221;atotech-smallslider&#8221; header_font_size=&#8221;46&#8243; body_font_size=&#8221;16&#8243; button_text_size=&#8221;20&#8243; button_border_width=&#8221;2&#8243; button_border_radius=&#8221;3&#8243; button_border_radius_hover=&#8221;3&#8243; module_id=&#8221;Top&#8221;]<\/p>\n<p>[et_pb_slide background_position=&#8221;top_center&#8221; background_size=&#8221;default&#8221; background_color=&#8221;#ffffff&#8221; alignment=&#8221;center&#8221; background_layout=&#8221;dark&#8221; allow_player_pause=&#8221;off&#8221; header_font_select=&#8221;default&#8221; body_font_select=&#8221;default&#8221; custom_button=&#8221;off&#8221; button_font_select=&#8221;default&#8221; button_use_icon=&#8221;default&#8221; button_icon_placement=&#8221;right&#8221; button_on_hover=&#8221;on&#8221; background_image=&#8221;\/wp-content\/uploads\/2016\/02\/pp-top.jpg&#8221;]<\/p>\n<p>&nbsp;<\/p>\n<div class=\"slidercontent-left\">\n<h3>Providing electrolytes for the highest requirements<\/h3>\n<p>&nbsp;<\/p>\n<h3>in reliability and productivity<\/h3>\n<\/div>\n<p>[\/et_pb_slide]<\/p>\n<p>[\/et_pb_fullwidth_slider][\/et_pb_section][et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; custom_padding=&#8221;0|&#8221; padding_mobile=&#8221;off&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; module_class=&#8221;breadcrumb-container&#8221; gutter_width=&#8221;3&#8243;][et_pb_row admin_label=&#8221;row&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;4_4&#8243;][et_pb_text admin_label=&#8221;Breadcrumbs&#8221; background_layout=&#8221;light&#8221; text_orientation=&#8221;left&#8221; use_border_color=&#8221;off&#8221; border_color=&#8221;#ffffff&#8221; border_style=&#8221;solid&#8221; custom_margin=&#8221;0|||&#8221; text_font_size=&#8221;14&#8243; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;]<\/p>\n<nav class=\"atotech-breadcrumb\"><a href=\"https:\/\/www.atotech.com\/cn\/\">Home<\/a> <span class=\"bc-divider\"><i class=\"icon-arrow\"><\/i><\/span> <span class=\"current-page\">Page<\/span><\/nav>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; fullwidth=&#8221;off&#8221; specialty=&#8221;off&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; padding_mobile=&#8221;off&#8221; module_class=&#8221;atotech-about-extended&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243;][et_pb_row admin_label=&#8221;row&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;4_4&#8243;][et_pb_text admin_label=&#8221;InPro SAP2&#8243; background_layout=&#8221;light&#8221; text_orientation=&#8221;center&#8221; text_font_size=&#8221;16&#8243; border_style=&#8221;solid&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221; _builder_version=&#8221;3.0.62&#8243;]<\/p>\n<h1>InPro<sup>\u00ae<\/sup> SAP2<\/h1>\n<h3>BMV filling for IC-Substrates in VCL using insoluble anodes<\/h3>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row admin_label=&#8221;row&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;1_3&#8243;][et_pb_blurb admin_label=&#8221;SAP pattern BMV filling&#8221; title=&#8221;SAP pattern BMV filling&#8221; url_new_window=&#8221;off&#8221; use_icon=&#8221;off&#8221; icon_color=&#8221;#7EBEC5&#8243; use_circle=&#8221;off&#8221; circle_color=&#8221;#7EBEC5&#8243; use_circle_border=&#8221;off&#8221; circle_border_color=&#8221;#7EBEC5&#8243; icon_placement=&#8221;top&#8221; animation=&#8221;top&#8221; background_layout=&#8221;light&#8221; text_orientation=&#8221;center&#8221; use_icon_font_size=&#8221;off&#8221; use_border_color=&#8221;off&#8221; border_color=&#8221;#ffffff&#8221; border_style=&#8221;solid&#8221; header_font_size=&#8221;18&#8243; body_font_size=&#8221;14&#8243; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;]<\/p>\n<p>Rectangular pattern track profile and excellent within-unit distribution<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8221;1_3&#8243;][et_pb_blurb admin_label=&#8221;For fine lines&#8221; title=&#8221;For fine lines&#8221; url_new_window=&#8221;off&#8221; use_icon=&#8221;off&#8221; icon_color=&#8221;#7EBEC5&#8243; use_circle=&#8221;off&#8221; circle_color=&#8221;#7EBEC5&#8243; use_circle_border=&#8221;off&#8221; circle_border_color=&#8221;#7EBEC5&#8243; icon_placement=&#8221;top&#8221; animation=&#8221;top&#8221; background_layout=&#8221;light&#8221; text_orientation=&#8221;center&#8221; use_icon_font_size=&#8221;off&#8221; use_border_color=&#8221;off&#8221; border_color=&#8221;#ffffff&#8221; border_style=&#8221;solid&#8221; header_font_size=&#8221;18&#8243; body_font_size=&#8221;14&#8243; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;]<\/p>\n<p>Process suited for next generation production with low surface plated copper and minimum dimple<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8221;1_3&#8243;][et_pb_blurb admin_label=&#8221;Optimised for mass production&#8221; title=&#8221;Optimised for mass production&#8221; url_new_window=&#8221;off&#8221; use_icon=&#8221;off&#8221; icon_color=&#8221;#7EBEC5&#8243; use_circle=&#8221;off&#8221; circle_color=&#8221;#7EBEC5&#8243; use_circle_border=&#8221;off&#8221; circle_border_color=&#8221;#7EBEC5&#8243; icon_placement=&#8221;top&#8221; animation=&#8221;top&#8221; background_layout=&#8221;light&#8221; text_orientation=&#8221;center&#8221; use_icon_font_size=&#8221;off&#8221; use_border_color=&#8221;off&#8221; border_color=&#8221;#ffffff&#8221; border_style=&#8221;solid&#8221; header_font_size=&#8221;18&#8243; body_font_size=&#8221;14&#8243; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;]<\/p>\n<p>High applicable current densities in vertical conveyorised lines<\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; fullwidth=&#8221;off&#8221; specialty=&#8221;off&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; padding_mobile=&#8221;off&#8221; module_class=&#8221;atotech-about-extended&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243; background_color=&#8221;#d8d8d8&#8243; custom_padding=&#8221;30px||20px|&#8221;][et_pb_row background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;4_4&#8243;][et_pb_tabs admin_label=&#8221;What is it?&#8221; border_style=&#8221;solid&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221; _builder_version=&#8221;3.0.62&#8243;]<\/p>\n<p>[et_pb_tab title=&#8221;Product details&#8221; tab_font_select=&#8221;default&#8221; body_font_select=&#8221;default&#8221; use_background_color_gradient=&#8221;off&#8221; background_color_gradient_start=&#8221;#2b87da&#8221; background_color_gradient_end=&#8221;#29c4a9&#8243; background_color_gradient_type=&#8221;linear&#8221; background_color_gradient_direction=&#8221;180deg&#8221; background_color_gradient_direction_radial=&#8221;center&#8221; background_color_gradient_start_position=&#8221;0%&#8221; background_color_gradient_end_position=&#8221;100%&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;on&#8221; background_size=&#8221;cover&#8221; background_position=&#8221;center&#8221; background_repeat=&#8221;no-repeat&#8221; background_blend=&#8221;normal&#8221; allow_player_pause=&#8221;off&#8221; tab_font=&#8221;||||&#8221; body_font=&#8221;||||&#8221;]<\/p>\n<div class='one_third'>\n\t\t\t\t\t<div id=\"attachment_5529\" style=\"width: 310px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-5529\" class=\"wp-image-5529\" src=\"\/wp-content\/uploads\/2016\/06\/el-pp-InPro-SAP2-Pattern-IC-Substrate-BMV-filling-at-low-surface-copper-226x300.jpg\" alt=\"Atotech\" width=\"300\" height=\"399\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/06\/el-pp-InPro-SAP2-Pattern-IC-Substrate-BMV-filling-at-low-surface-copper-226x300.jpg 226w, https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/06\/el-pp-InPro-SAP2-Pattern-IC-Substrate-BMV-filling-at-low-surface-copper.jpg 573w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><p id=\"caption-attachment-5529\" class=\"wp-caption-text\">Pattern IC Substrate BMV filling at low surface copper<\/p><\/div>\n\t\t\t\t<\/div> <div class='two_third et_column_last'>\n\t\t\t\t\t<p>InPro<sup>\u00ae<\/sup> SAP2 is a vertical pattern BMV Filling Process using insoluble anodes for best plating uniformity in vertical equipment. It has been developed for IC Substrates for use in DC mode including sparger agitation and external copper replenishment. Relatively high current densities (&lt; 3 A\/dm\u00b2) may be used to ensure high productivity.<\/p>\n<p>Following the trends of the IC Substrate market the process enables optimal BMV filling at minimum copper thickness. It allows the plating of fine lines for current (10 \u00b5m\/ 10 \u00b5m) and future demands (5 \u00b5m\/ 5 \u00b5m). In contrast to existing BMV filling processes it provides an excellent within-unit distribution e.g. for Flip-Chip pattern plating.<\/p>\n\t\t\t\t<\/div><div class='clear'><\/div><\/p>\n<p>[\/et_pb_tab][et_pb_tab title=&#8221;Application&#8221; tab_font_select=&#8221;default&#8221; body_font_select=&#8221;default&#8221;]<\/p>\n<p><div class='one_third'>\n\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-2913 size-full\" src=\"\/wp-content\/uploads\/2016\/02\/Consumer-electronics_low.png\" alt=\"Atotech\" width=\"100\" height=\"100\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-5160 size-full\" src=\"\/wp-content\/uploads\/2016\/06\/Package_substrate_low.png\" alt=\"Atotech\" width=\"100\" height=\"100\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-4719 size-full\" src=\"\/wp-content\/uploads\/2016\/05\/HDI_low.png\" alt=\"Atotech\" width=\"100\" height=\"100\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-5170 size-full\" src=\"\/wp-content\/uploads\/2016\/06\/PCB_low.png\" alt=\"Atotech\" width=\"100\" height=\"100\">\n\t\t\t\t<\/div> <div class='two_third et_column_last'>\n\t\t\t\t\t<ul>\n<li>Pattern BMV filling process for IC substrates<\/li>\n<li>Fine line plating with excellent within-unit distribution<\/li>\n<li>For use with VCL using sparger electrolyte agitation<\/li>\n<li>Insoluble anodes with external Cu replenishment<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div><\/p>\n<p>[\/et_pb_tab][et_pb_tab title=&#8221;Features and benefits&#8221; tab_font_select=&#8221;default&#8221; body_font_select=&#8221;default&#8221;]<\/p>\n<div class='one_third'>\n\t\t\t\t\t<div id=\"attachment_4440\" style=\"width: 310px\" class=\"wp-caption alignleft\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-4440\" class=\"wp-image-4440 size-medium\" src=\"\/wp-content\/uploads\/2016\/05\/InPro-SAP2-product-details-2-300x179.jpg\" alt=\"Atotech\" width=\"300\" height=\"179\"><p id=\"caption-attachment-4440\" class=\"wp-caption-text\">BMV (60 \u00d7 30 \u00b5m) pattern plate at 1.5 A\/dm\u00b2<\/p><\/div>\n\t\t\t\t<\/div> <div class='two_third et_column_last'>\n\t\t\t\t\t<ul>\n<li>Pattern BMV filling with excellent within-unit distribution<\/li>\n<li>Low dimple BMV Filling at low surface copper, no \u201cdome\u201d effect<\/li>\n<li>Rectangular track profile without ski slope<\/li>\n<li>Stable filling performance at extended bath life<\/li>\n<li>Wide working window for highest process flexibility<\/li>\n<li>Works in DC mode with insoluble anodes for best surface uniformity and high productivity<\/li>\n<li>All additives may be controlled using CVS<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div><\/p>\n<p>[\/et_pb_tab]<\/p>\n<p>[\/et_pb_tabs][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; fullwidth=&#8221;off&#8221; specialty=&#8221;off&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; padding_mobile=&#8221;off&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243; custom_padding=&#8221;50px|||&#8221; disabled=&#8221;off&#8221;][et_pb_row admin_label=&#8221;row&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;4_4&#8243;][et_pb_text admin_label=&#8221;Why we developed InPro SAP2&#8243; background_layout=&#8221;light&#8221; text_orientation=&#8221;left&#8221; text_font_size=&#8221;16&#8243; border_style=&#8221;solid&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221; _builder_version=&#8221;3.0.62&#8243;]<\/p>\n<h2 style=\"text-align: center;\">Why we developed InPro<sup>\u00ae<\/sup> SAP2<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row admin_label=&#8221;row&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;1_2&#8243;][et_pb_testimonial admin_label=&#8221;Challenge&#8221; url_new_window=&#8221;off&#8221; quote_icon=&#8221;off&#8221; use_background_color=&#8221;on&#8221; background_color=&#8221;#d8d8d8&#8243; background_layout=&#8221;light&#8221; text_orientation=&#8221;left&#8221; portrait_border_radius=&#8221;50&#8243; portrait_width=&#8221;90&#8243; portrait_height=&#8221;90&#8243; body_font_size=&#8221;16&#8243; use_border_color=&#8221;off&#8221; border_color=&#8221;#ffffff&#8221; border_style=&#8221;solid&#8221; portrait_url=&#8221;\/wp-content\/uploads\/2016\/04\/challenge1.png&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;]<\/p>\n<h2 style=\"color: #5992d6;\">Your challenge<\/h2>\n<p>BMV filling in fine line pattern plating mode with minimum dimples is a standard requirements within the IC Substrates field. Increasing demands for uniformity need a good within-unit distribution as well.<br \/>\nTo meet your process and operational targets the required filling processes must provide void free filling, a minimum of surface plated copper along with the excellent within-unit distribution.<\/p>\n<p>[\/et_pb_testimonial][\/et_pb_column][et_pb_column type=&#8221;1_2&#8243;][et_pb_testimonial admin_label=&#8221;Solution&#8221; url_new_window=&#8221;off&#8221; quote_icon=&#8221;off&#8221; use_background_color=&#8221;on&#8221; background_color=&#8221;#d8d8d8&#8243; background_layout=&#8221;light&#8221; text_orientation=&#8221;left&#8221; body_font_size=&#8221;16&#8243; border_style=&#8221;solid&#8221; portrait_url=&#8221;\/wp-content\/uploads\/2016\/03\/Solution.png&#8221; background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221; _builder_version=&#8221;3.0.62&#8243; quote_icon_background_color=&#8221;#f5f5f5&#8243;]<\/p>\n<h2 style=\"color: #5992d6;\">Our solution<\/h2>\n<p>InPro<sup>\u00ae<\/sup> SAP2 is a BMV filling process for vertical conveyorised systems using insoluble anodes with copper oxide replenishment and sparger agitation. The process has been developed in order to fulfill the current and future IC Substrate market requirements for fine line pattern plating, granting minimum surface plated copper BMV filling whilst giving optimum within-unit distribution. With its applicable high current densities, it is the ideal process for high volume production.<\/p>\n<p>[\/et_pb_testimonial][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; fullwidth=&#8221;off&#8221; specialty=&#8221;off&#8221; transparent_background=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; inner_shadow=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; padding_mobile=&#8221;off&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; make_equal=&#8221;off&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243;][et_pb_row admin_label=&#8221;row&#8221; make_fullwidth=&#8221;off&#8221; use_custom_width=&#8221;off&#8221; width_unit=&#8221;on&#8221; use_custom_gutter=&#8221;off&#8221; gutter_width=&#8221;3&#8243; padding_mobile=&#8221;off&#8221; allow_player_pause=&#8221;off&#8221; parallax=&#8221;off&#8221; parallax_method=&#8221;off&#8221; 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Providing electrolytes for the highest requirements &nbsp; in reliability and productivity <nav class=\"atotech-breadcrumb\"><a href=\"https:\/\/www.atotech.com\/cn\/\">Home<\/a> <span class=\"bc-divider\"><i class=\"icon-arrow\"><\/i><\/span> <span class=\"current-page\">Page<\/span><\/nav> InPro\u00ae SAP2 BMV filling for IC-Substrates in VCL using insoluble anodes Rectangular pattern track profile and excellent within-unit distribution Process suited for next generation production with low surface plated copper and minimum dimple High applicable current densities in vertical conveyorised lines <div class='one_third'>\n\t\t\t\t\t\n\t\t\t\t<\/div> [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"parent":48558,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":3,"footnotes":""},"class_list":["post-9785","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/pages\/9785","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=9785"}],"version-history":[{"count":2,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/pages\/9785\/revisions"}],"predecessor-version":[{"id":92998,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/pages\/9785\/revisions\/92998"}],"up":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/pages\/48558"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=9785"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}