Berlin, November 22, 2019: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 2019 International Electronics Circuit Exhibition in Shenzhen, China, on December 4th ¨C 6th.
On Thursday, December 5, Atotech expert Kuldip Johal will give a presentation entitled: ¡°Moving to mmWave ¨C how does this impact the PCB / IC substrate¡±, from 2:00 ¨C 2:40 p.m. at the International Technical Conference area in hall 4.
Visitors of the HKPCA 2019 are welcome to join Atotech¡¯s expert talk on 5G trends, challenges and solutions and to stop by the company¡¯s booth 2D21. Mr. Johal and several other global and local Atotech experts will be available to discuss the latest product innovations and trends.
Atotech¡¯s key highlights at the booth include:
- vPlate? ¨C Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
- Polygon? PLB Line? ¨C Atotech¡¯s new desmear and electroless copper system.
- ViaKing? ¨C Atotech’s new enhanced graphite direct metallization for flex and advanced base materials.
- Noviganth? AF ¨C High build self-accelerating electroless copper process.
- InPro? THF2 ¨C Atotech¡¯s (a)mSAP BMV filling process for best uniformity with high ductility.
- InPro? MVF2 ¨C Advanced BMV filling in VCP equipment for HDI production.
- BondFilm? HF1000 ¨C Bonding enhancement process for high frequency manufacturing.
- CupraEtch? SR8000 ¨C Dryfilm and soldermask pretreatment with advanced adhesion performance.
- PallaBond? ¨C Direct pure EPAG for ultra fine L/S application.
- Stanna-COF ¨C Immersion tin for chip on film.
- Spherolyte? Cu UF3 ¨C Cu RDL process for fine line plating and microvia filling.