Berlin, June 19, 2020: Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging, and dual damascene applications, is pleased to announce its participation in this year¡¯s SEMICON China, held at the Shanghai New International Expo Center from June 27 ¨C 29. CSTIC will be held as a virtual conference in conjunction with SEMICON China from June 26 ¨C July 17, 2020.
Atotech¡¯s experts will be present at booth E5317 and visitors are welcome to discuss the company¡¯s latest innovations, future developments and trends in the electronics industry.
Highlights at the booth will include:
Spherolyte? Cu UF3: A high-purity ECD Copper process that enables high-speed plating of pure Copper for pillar applications.
Xenolyte? Zincate CFA2 : A universal pretreatment process for all types of Aluminum and Aluminum alloy wafers.
Xenolyte? Pd HS : Pure Palladium deposits for high-reliability pad metallization and RDL housing.
MultiPlate? ECD system for power IC: Enables simultaneous Copper deposition for embedding power chips.
NEAP X.1 / X.2: Next generation through-hole and blind micro via filling process for use in VCP systems with insoluble anodes.
SuperDip 21N: Atotech¡¯s 2-in-1 anti-tarnish and anti-EBO post-treatment for leadframe application on both Copper and Silver surfaces and even Nickel/Palladium/Gold.
Atotech is also pleased to announce, that Din-Ghee Neoh, Atotech¡¯s Business Manager for Leadframe and Connector technology, will participate in the virtual conference, CSTIC, with a pre-recorded video presentation. He will discuss: ¡°Enhancing high temperature adhesion performance via a renovated leadframe surface treatment¡± and his presentation will be available for replay for the entire event (June 26 ¨C July 17).
Conference: SEMICON China
Date: June 27 ¨C 29, 2020
Venue: Shanghai New International Expo Center
Atotech booth no.: E5317
For more information, please visit:
Conference: CSTIC 2020
Date: June 26 ¨C July 17, 2020
For more information, please visit:
“Enhancing high temperature adhesion performance via a renovated leadframe surface treatment”
Our pre-recorded video presentation, held by Din-Ghee Neoh, will be available for replay from June 26 – July 17.