Berlin,?February 15, 2022?– Atotech is looking forward to presenting at 18th International Conference & Exhibition on Device Packaging. This international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS) will take place from March 7-10 in Fountain Hills, AZ.
Our experts are excited to have the opportunity to present the following technical paper:
Thursday, March 10, 2022
Time slot: 10:00 a.m. ¨C 10:30 a.m. (MST)
Presenter: Dr. Britta Schafsteller, Global Product Manager Selective Finishing
Paper topic: How to tailor immersion tin plating for IC substrate applications
Conference:
18th?Annual Device Packaging Conference (DPC?2022)
Date: March 7-10, 2022
Venue: WeKoPa?Resort and Conference Center in Fountain Hills, Arizona, USA
Our experts are looking forward to seeing you there!
More information on the show and the location can be found here: