Berlin, September 7, 2021 – Berlin, September 7, 2021 ¨C Atotech, a global supplier of specialty chemicals, equipment, software, and services announced its presence during the ongoing 20th INTERFINISH World Congress from September 6 to 8. Under the guidance of the International Union of Surface Finishing (IUSF), this year¡¯s conference has been organized as an online digital event.
As part of the conference program, Atotech has been invited to present the following:
Presentation schedule:
| Presentation title | Date | Time (JST) | Speaker |
| BluCr? Trivalent Hard Chrome Process | 6-Sep-21 | 17:00-17:20 | Josep Sans |
| Fumalock? – The non-PFAS, non-PFOS fume suppressant for chrome plating | 6-Sep-21 | 17:40-18:00 | Josep Sans |
| Nichem? HP 1170 ¨C Superior corrosion resistant high P EN process | 6-Sep-21 | 17:40-18:00 | Shakeel Akhtar |
| Hexavalent chromium free pretreatment for plastics ¨C Covertron? | 6-Sep-21 | 16:40-17:00 | Ernesto Salazar |
| Cupracid? PV ¨C Solar cell metallization by low-stress and ductile copper plating | 6-Sep-21 | 16:00-16:20 | Torsten Voss |
| Metallization of additive manufactured polymer parts in decorative and functional applications | 6-Sep-21 | 14:50-15:10 | Michael Merschky |
| High end corrosion protection with zinc©\iron alloy: Hiron? | 6-Sep-21 | 16:20-16:40 | Mike Kr¨¹ger |
| Zintek? ONE HP: One zinc flake layer ¨C Great corrosion protection | 6-Sep-21 | 15:10-15:30 | Markus Ahr |
| Near neutral pH weld descaling ¨C Improving quality with sustainable chemical solutions | 7-Sep-21 | 8:30-8:50 | Brandon Lloyd |
| Carbon Footprint Reduction | 7-Sep-21 | 8:10-8:30 | Brandon Lloyd |
| A new era of In-house chemical paint removal ¨C the ideal choice for hook and rack cleaning | 6-Sep-21 | 15:30-15:50 | Sylvain Masson |
| DynaSmart? ©\ innovative compact modular plating line for high productivity and greater flexibility with a smaller environmental footprint | 6-Sep-21 | 17:20-17:40 | Steffen Seuss |
| Introduction of a Novel Palladium Free Activator for Electroless Copper Processing | 6-Sep-21 | 16:40-17:00 | Roger Massey |
| Layer Characteristics of Electroless Palladium and Autocatalytic Gold and its impacting factors | 6-Sep-21 | 17:00-17:20 | Britta Schafsteller |
| Novel adhesion enhancement system for high-speed substrates manufacturing | 6-Sep-21 | 16:00-16:20 | Toshio Honda |
| Advanced adhesion promotion system for metallization of copper on glass substrate. | 6-Sep-21 | 15:30-15:50 | Toshio Honda |
| A Non-Etched Non-Roughened Adhesion Promoter for PPF (Pre-Plated Lead frames) | 8-Sep-21 | 10:00-10:20 | Din-Ghee Neoh |
| Challenges and solutions in electroless under bump metallization (UBM) -The final finish for highest reliability in wire bonding and soldering applications | 6-Sep-21 | 17:20-17:40 | Stefan Pieper |
All our presentations will also be available as recordings for all conference registrants.
Conference: INTERFINISH 2021 ¨C 20th world congress
Date: September 6 ¨C 8, 2021
For more information, please visit: